Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device

A method for fabricating a semiconductor device comprising:

• a resin sealing step of loading a substrate on which semiconductor elements having protruding electrodes are formed to a mold, and supplying a sealing resin to positions of the protruding electrodes so as to form a resin layer which seals the protruding electrodes and the substrate;
• a protruding electrode exposing step of exposing at least ends of the protruding electrodes from the resin layer;
• and
• a separating step of cutting the substrate together with the resin layer so that the semiconductor elements are separated from each other,
• wherein the resin sealing step disposes a film between the protruding electrodes and the mold, which thus contacts the sealing resin through the film, wherein:
• cutting position grooves are formed, before the resin sealing step is carried out, in the substrate so as to be located in positions in which the substrate is cut in the separating step;
• and
• the substrate is cut in the cutting position grooves after being filled with the sealing resin.

A method for fabricating a semiconductor device comprising:

• a resin sealing step of loading a substrate on which semiconductor elements having protruding electrodes are formed to a mold, and supplying a sealing resin to positions of the protruding electrodes so as to form a resin layer which seals the protruding electrodes and the substrate;
• a protruding electrode exposing step of exposing at least ends of the protruding electrodes from the resin layer;
• and
• a separating step of cutting the substrate together with the resin layer so that the semiconductor elements are separated from each other,
• wherein the resin sealing step disposes a film between the protruding electrodes and the mold, which thus contacts the sealing resin through the film, wherein:
• a pair of stress relaxing grooves is formed, prior to the resin sealing step, so as to sandwich a position in which the substrate is to be cut;
• and
• the substrate is cut in a position interposed between the pair of stress relaxing grooves in the separating step.

A method for fabricating a semiconductor device comprising:

• a mold preparing step of preparing a mold including a first mold, and a second mold which is located so as to face the first mold, the second mold including a first half body having a shape corresponding to a shape of a substrate, and a second half body which is provided so as to surround the first half body and can be elevated with respect to the first half body, the first and second half bodies cooperating with each other so that a cavity to be filled with resin is defined;
• a resin sealing step of placing the substrate on which a plurality of semiconductor elements equipped with protruding electrodes are formed in the mold and supplying resin to positions in which the protruding electrodes are provided so as to form a resin layer which seals the protruding electrodes and the substrate;
• a protruding electrode exposing step of exposing at least end portions of the protruding electrodes from the resin layer;
• and
• a separating step of cutting the substrate together with the resin layer so that the semiconductor elements are separated into each other,
• wherein the resin sealing step disposes a film between the protruding electrodes and the mold, which thus contacts the sealing resin through the film and the film used in the resin sealing step is formed of an elastically deformable substance, and the ends of the protruding electrodes are caused to fall in the film when the resin layer is formed by using the mold;
• and
• the film is detached from the resin layer in the protruding electrode exposing step so that the ends of the protruding electrodes can be exposed from the resin layer.