Method of diffusion bonding superalloy laminates
AssigneeTriumph Brands, Inc.
InventorsRichard J. Stueber, Brenton L. Blanche
Life of this patent
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Abstract
A method of joining superalloy substrates together comprises diffusion bonding the superalloy substrates by depositing an activator directly on the surface of the joint to be bonded and thereafter subjecting the joint to heat and pressure. The heat and pressure causes the surface of the superalloy, in the presence of the activator, to diffusion bond without the use of a brazing alloy. By eliminating the brazing alloy, a high strength, high temperature bond is achieved, yet there is no molten brazing alloy to be drawn through capillary action into any fine features surrounding the joint being bonded, and there is no residue left at the interface that would diminish the mechanical or chemical properties of the joint.
Claims23
A method of bonding a first article formed of a superalloy material to a second article also formed of a superalloy material comprising:
- cleaning a surface of said first article;
- cleaning a surface of said second article;
- applying an activator material to said surface of said first article, said activator material comprising a melting point depressant mixed with a carrier material that is substantially free of Nickel, Cobalt and Iron;
- bringing said surface of said first article in contact with said surface of said second article at an interface;
- applying a load at said interface to force said surface of said first article and said surface of said second article together;
- and
- heating said interface in an inert environment to cause said melting point depressant to diffuse into said surface of said first article and said surface of said second article thereby causing said first and second articles to diffusion bond together.
A method of bonding a first article formed of a superalloy material to a second article formed of a superalloy material comprising:
- cleaning a surface of said first article;
- cleaning a surface of said second article;
- applying an activator to said surface of said first article, said activator comprising an organic compound containing a melting point depressant;
- bringing said surface of said first article in contact with said surface of said second article at an interface;
- applying a load at said interface to force said surface of said first article and said surface of said second article together;
- and
- heating said interface in an inert atmosphere until said organic compound is disassociated allowing said melting point depressant to diffuse into at least said first article to form a bond between said first article and said second article, said bond having no interfacial residue.
A method of bonding a first article formed of a superalloy material to a second article formed of a superalloy material comprising:
- cleaning a surface of said first article by subjecting said surface to a gaseous halide;
- cleaning a surface of said second article by subjecting said surface to a gaseous halide;
- applying an activator material to said surface of said first article, said activator material comprising a melting point depressant;
- placing said first article and said second article within an enclosure such that said surface of said first article is in contact with said surface of said second article at an interface, said enclosure containing an inert atmosphere;
- and
- applying heat and force to said enclosure, to cause said enclosure to transmit heat and pressure to said interface so as to allow said melting point depressant to diffuse into at least said first article to form a bond between said first article and said second article.
Dependencies are inferred from the claim text.