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US 6,880,560 B2Granted
Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
AssigneesTechsonic, Recif, S.A.
InventorsGil Ching, Vincent Perrut, Vincent Ruch, Gilles Fresquet
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Abstract
Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.
Claims15
A method for processing a substrate, the method comprising:
- a) introducing a substrate into a processing chamber;
- b) introducing a dense phase gas into the processing chamber;
- c) producing sonic energy substantially perpendicularly to the substrate inside of the processing chamber using a sonic box comprising a transducer coupled to a membrane, wherein the sonic box includes a body forming an enclosure and an incompressible liquid inside of the enclosure;
- and
- d) processing the substrate using the sonic energy and the dense phase gas.
2 more elements
Dependencies are inferred from the claim text.