Two stage radiation thermoelectric cooling apparatus
AssigneeGiga-Byte Technology Co., Ltd.
InventorsHsiang-Chieh Tseng, Yi-Song Liu, Chia-Min Chou, Chia-Feng Yeh
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AssigneeGiga-Byte Technology Co., Ltd.
InventorsHsiang-Chieh Tseng, Yi-Song Liu, Chia-Min Chou, Chia-Feng Yeh
Estimating the term…
The present invention provides a thermoelectric cooling apparatus for cooling an electronic device such as a CPU, or a computer chip. The apparatus cools the electronic device by two stages. In the first stage, a heat absorbing block collects the heat produced by the electronic device and the apparatus pre-cools the electronic device by dissipating a portion of the collected heat in a distant location through a front heat conductive device and a front radiator. Thereby the heat of the electronic device is reduced to a degree that a TEC can efficiently handle. In the second stage, a TEC of the apparatus dissipate the residual of the heat produced by the electronic device through at least a back heat pipe and a back radiator.
A thermoelectric cooling apparatus for cooling an electronic device comprising:
A thermoelectric cooling apparatus for cooling an electronic device comprising:
Dependencies are inferred from the claim text.