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US 6,878,567 B2Granted
Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates
AssigneeIntel Corporation
InventorsPaul Winer, George P. Vakanas
Life of this patent
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Abstract
A method and apparatus for fabrication of passivated microfluidic structures is disclosed. The method includes providing a substrate having a microfluidic structure formed therein. The microfluidic structure is embedded by an embedding layer. The method further includes passivating the embedded microfluidic structure by locally heating the microfluidic structure surface in a reactive atmosphere, wherein the passivated microfluidic structure is suitable for transporting a fluid.
Claims23
A method comprising:
- providing a substrate having a silicon dioxide or silicon nitride embedding layer;
- forming a channel structure in the substrate by exposing a part of the substrate underneath the embedding layer to light from a laser source;
- and
- passivating the embedded channel structure by using a laser light to pass through the embedding layer to locally heat a portion the channel structure underneath the embedding layer in a reactive atmosphere.
1 more element
A method comprising:
- providing a substrate having a silicon dioxide or silicon nitride embedding layer;
- forming a microfluidic structure in the substrate by exposing at least a part of the substrate underneath the embedding layer to light from a laser source
- introducing a reactive atmosphere to the embedded microfluidic structure;
- using a laser light to locally heat a portion of the microfluidic structure underneath the embedding layer to passivate the embedded microfluidic structure in the reactive atmosphere;
- and
- wherein the passivated microfluidic structure is suitable for transporting a fluid.
3 more elements
Dependencies are inferred from the claim text.