US 6,876,846 B2Granted

High frequency module

AssigneeMitsubishi Denki Kabushiki Kaisha

InventorsTsutomu Tamaki, Takuya Suzuki, Koichi Matsuo, Hiroshi Kai

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Abstract

Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

Claims35

Dependent claims

A high frequency module comprising:

a first dielectric substrate provided with a first and a second waveguide;
a second dielectric substrate laminated on said first dielectric substrate and provided with a first cavity and a second cavity, disposed so as to be separate from each other, and said first and second waveguides;
a third dielectric substrate laminated on said second dielectric substrate and having a third cavity, inside of which is positioned said first cavity, and a fourth cavity, inside of which is positioned said second cavity, disposed apart from said third cavity and having a slot for communicating to said third cavity, with said first and second waveguides respectively provided outside said third and fourth cavities;
a metal conductor provided so as to seal said third and fourth cavities;
a plurality of first high frequency circuits installed within said first cavity;
a plurality of second high frequency circuits installed within said second cavity;
a first connection line provided within said communicating slot and connecting between said first and second high frequency circuits;
and
a second and third connection line respectively connecting said first and second high frequency circuits with said first and second waveguides.

6 more elements

A high frequency module comprising:

a first dielectric substrate provided with a first and second waveguide;
a second dielectric substrate laminated on said first dielectric substrate and provided with a first cavity and a second cavity disposed so as to be separate from each other, and said first and second waveguides;
a metal conductor having a third cavity, in which is positioned inside said first cavity, and a fourth cavity inside which is positioned said second cavity, disposed apart from said third cavity and having a slot for communicating to said third cavity, with said first and second waveguides respectively provided outside said third and fourth cavities;
a plurality of first high frequency circuits installed within said first cavity;
a plurality of second high frequency circuit installed within said second cavity;
a first connection line provided within said communicating slot and connecting between said first and second high frequency circuits;
and
a second and third connection line for respectively connecting said first and second high frequency circuits with said first and second waveguides.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/934,481Filed 23 Aug 2001
Priority: JP 2000-25411524 Aug 2000
Published: US 2002/0025794 A128 Feb 2002
Granted: 5 Apr 2005
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

G01S 7/032
Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver: constructional details for solid-state radar subsystems
H01P 7/065
Cavity resonators: integrated in a substrate
H10W 44/20
Electrical arrangements for controlling or matching impedance: at high-frequency [HF] or radio frequency [RF]
G01S 13/34
Using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated: using transmission of continuous,…