Electrical connector with circuit board module
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsIosif R. Korsunsky, Chong H. Yi, Tod M. Harlan, Eric D. Juntwait
Life of this patent
Estimating the term…
Abstract
An electrical connector (100) includes a unitary insulative housing (1) defining a number of parallel slots (13), a number of parallelly arranged circuit board modules (3) and a shield member (2) attached to the housing. The circuit board modules are retained by and between the shield member and the housing. Each circuit board module includes a dielectric spacer (30), a circuit board (36) attached to the dielectric spacer and received in a corresponding slot of the housing, and a row of press-fit contacts (38) mechanically and electrically connecting with the circuit board and disposed in the corresponding slot.
Claims14
An electrical connector comprising:
- a unitary insulative housing defining a plurality of parallel slots;
- a plurality of parallelly arranged circuit board modules each comprising a dielectric spacer, a circuit board attached to the dielectric spacer and received in a corresponding slot of the housing, and a row of contacts mechanically and electrically connecting with the circuit board and disposed in the corresponding slot;
- and
- a shield member attached to the housing, the circuit board modules being retained by and between the shield member and the housing.
A circuit board assembly for using in an electrical connector for high speed signal transmission, comprising:
- a circuit board comprising a mating portion adapted for engaging with a complementary element, a mounting portion with a fusible element disposed thereon and defining a plated through hole therein;
- and
- a contact including an intermediate portion, a connecting portion extending upwardly from the intermediate portion and surface mounted to the mounting portion, and a tail portion extending downwardly from the intermediate portion adapted for connecting with a printed circuit board, the connecting portion having a projection received in the plated through hole, interstitial space between the plated through hole and the projection being substantially filled with fusible element after melting and solidifying the fusible element.
Dependencies are inferred from the claim text.