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US 6,872,505 B1Granted
Enabling chain scission of branched photoresist
AssigneeIntel Corporation
InventorsHeidi B. Cao, Robert P. Meagley
Life of this patent
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Abstract
By using a branched long chained chain scission polymer as a photoresist for EUV and 157 nanometer applications, a relatively higher molecular weight polymer with good mechanical properties may be achieved. In addition, by using chain scission technology, line edge roughness and resolution may be improved at the same time.
Claims9
A method comprising:
- forming a photoresist from a branched chain scission polymer.
Dependencies are inferred from the claim text.