Lightweight circuit board with conductive constraining cores
AssigneeThermalWorks, LLC
InventorsKalu K. Vasoya, Bharat M. Mangrolia, William E. Davis, Richard A. Bohner
Life of this patent
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Abstract
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
Claims15
A printed wiring board comprising:
- at least one carbon containing layer;
- at least one electrically conductive layer that includes at least one circuit;
- at least one dielectric layer located between the carbon containing layer and the electrically conductive layer;
- and
- wherein at least one electrical connection exists between the carbon containing layer and the circuit on the electrically conductive layer.
Dependencies are inferred from the claim text.