US 6,869,487 B1 · Process and apparatus for treating a workpiece such as a semiconductor wafer

Abstract

A novel chemistry, system and application technique reduces contamination of semiconductor wafers and similar substrates and enhances and expedites processing. A stream of liquid chemical is applied to the workpiece surface. Ozone is delivered either into the liquid process stream or into the process environment. The ozone is preferably generated by a high capacity ozone generator. The chemical stream is provided in the form of a liquid or vapor. A boundary layer liquid or vapor forms on the workpiece surface. The thickness of the boundary layer is controlled. The chemical stream may include ammonium hydroxide for simultaneous particle and organic removal, another chemical to raise the pH of the solution, or other chemical additives designed to accomplish one or more specific cleaning steps.

Claims25

Dependent claims

A method for processing a workpiece, comprising the steps of:

providing a liquid at a temperature in the range of about 25-150° C. onto a surface of the workpiece;
introducing ozone into an environment containing the workpiece at a rate of at least 90 grams per hour;
controlling a thickness of the liquid on the workpiece so as to form a liquid layer that allows for diffusion of the ozone through the layer to the surface of the workpiece;
and
reacting the ozone at the surface of the workpiece, to process the workpiece.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

09/621,028Filed 21 Jul 2000 · continuation in part

Priority

9 May 1997

Granted

22 Mar 2005

Term ends

Not estimatedThe source records don’t support an estimate.

Classification23 codes

H10P 70/18
Cleaning before device manufacture, i.e. Begin-Of-Line process: by combined dry cleaning and wet cleaning
B08B 3/00
Cleaning by methods involving the use or presence of liquid or steam
B08B 3/02
Cleaning by methods involving the use or presence of liquid or steam: cleaning by the force of jets or sprays
B08B 3/044
Cleaning involving contact with liquid: using agitated containers in which the liquid and articles or material are placed

Family

Application08/853,649Parent of this continuation-in-part · filed 9 May 1997

Application09/061,318Parent of this continuation-in-part · filed 16 Apr 1998

PCTUS99/08516Parent of this continuation-in-part · filed 16 Apr 1999

Application60/145,350Us provisional application · filed 23 Jul 1999

US 6,240,933 B1Parent of this continuation-in-part

US 6,869,487 B1This patent

From the US filing history. Foreign family members aren’t listed.

Process and apparatus for treating a workpiece such as a semiconductor wafer

Life of this patent

Process and apparatus for treating a workpiece such as a semiconductor wafer

Life of this patent

Abstract

Claims25