Method of ablating an opening in a hard, non-metallic substrate
AssigneeVirtek Laser Systems, Inc.
InventorsMichael Cummings, Glover Ruiz, Cecil Archibald
Life of this patent
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Abstract
A method of ablating a hole into a hard, non-metallic substrate is disclosed. At least on laser assembly capable of generating a laser beam in an axis having a focus that is moveable relative to said axis is provided. A focus of the laser beam is positioned adjacent at least one surface of the substrate. A first layer of the substrate is ablated by the laser beam. The focus is moved relative to the axis corresponding to the depth of the substrate thereby enabling ablation of successive layers of the substrate. Successive layers of the substrate are ablated to generate a hole into the substrate.
Claims17
An apparatus for ablating a hole through a hard, nonmetallic workpiece comprising:
- a first laser assembly having a first galvanometer and a second laser assembly having a second galvanometer;
- said first laser assembly having a first optical lens for focusing a first laser beam emitted from said first laser assembly and said second laser assembly having a second optical lens for focusing a second laser beam emitted from said second laser assembly coincident with said first laser beam;
- and
- a controller first focusing said first and second laser beams on opposed surfaces of said hard, non-metallic workpiece to ablate first layers of said hard metallic workpiece at said opposed surfaces, said controller then refocusing said first and second laser beams in a Z axis to ablate second layers of said hard metallic workpiece adjacent said first layers, and said controller continuing to refocus said laser beams to ablate successive layers of said hard metallic workpiece in said Z axis, thereby forming said hole through said hard, non-metallic workpiece.
A method of ablating a configured opening in a clear, hard, non-metallic substrate, comprising the following steps:
- (a) focusing a first laser on one surface of said clear, hard, non-metallic substrate to ablate said one surface and form an opening in said one surface;
- (b) focusing a second laser on an opposed surface of said clear, hard, non-metallic substrate to ablate said opposed surface and form an opening in said opposed surface;
- (c) moving said focus of said first and second lasers relative to a Z axis corresponding to a depth of said hard, non-metallic substrate;
- and
- (d) repeating steps (b) and (c) to form a configured openings in said clear, hard, non-metallic substrate having a predetermined depth.
A method of ablating an opening through a clear, hard, non-metallic substrate, comprising the following steps:
- (a) focusing a first laser on a first surface of said clear, hard, non-metallic substrate thereby ablating a first layer of said first surface of said clear, hard, non-metallic substrate;
- (b) simultaneously focusing a second laser on a second surface of said clear, hard, non-metallic substrate opposite said first surface and coincident with said first laser, thereby ablating a second layer of said clear, hard, non-metallic substrate;
- (c) moving a focus of said first and second lasers relative to a z axis corresponding to a depth of said clear, hard, non-metallic substrate to ablate successive layers of said substrate;
- and
- (d) repeating step (c) until an opening is ablated through said substrate.
Dependencies are inferred from the claim text.