Method of inspecting ununiformity of transparent material, apparatus therefor, and method of selecting transparent substrate
AssigneeHoya Corporation
InventorMasaru Tanabe
Life of this patent
Estimating the term…
Loading patent…
AssigneeHoya Corporation
InventorMasaru Tanabe
Estimating the term…
A laser beam L from a laser 2 is introduced from an introducing surface into a transparent substrate 1 by using mirrors 31 and 32. The laser beam introduced through the transparent substrate 1 repeats a total reflection on the surfaces (main surfaces and end surfaces) of the transparent substrate 1 and enters a state in which the laser beam is almost confined in the substrate 1. When an ununiform portion such as a scratch exists on the surface of the transparent substrate 1, however, total reflecting conditions are not satisfied and the light leaks out of the ununiform portion. The leaked light is formed as an image on a CCD 6 by a lens system 7 and an image process is executed by an image processing apparatus 12. In a detected image, the ununiform portion in which the scratch or the like exists is brightly seen in a linear or a dot form in a black background, so that the ununiform portion such as a very fine scratch can be detected.
A method for inspecting an ununiformity of a transparent material by introducing a laser beam therein;
A method for inspecting an ununiformity of a transparent material by introducing a laser beam therein;
Dependencies are inferred from the claim text.