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US 6,858,478 B2Granted
Tri-gate devices and methods of fabrication
AssigneeIntel Corporation
InventorsRobert S. Chau, Brian S. Doyle, Jack Kavalieros, Douglas Barlage, Suman Datta, Scott A. Hareland
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Abstract
The present invention is a semiconductor device comprising a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate. A gate dielectric layer is formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body.
Claims3
A method of forming a semiconductor device comprising:
- forming an oxidation resistant film on a semiconductor body film formed on an insulating substrate;
- patterning said oxidation resistant film and said semiconductor body film to form an oxidation resistant mask a semiconductor body having a top surface opposite a bottom surface formed on said insulating film, and a first and a second laterally opposite sidewalls, wherein said oxidation resistant mask is formed on said top surface of said semiconductor body;
- growing an oxide on the laterally opposite sidewalls of said semiconductor body while said top surface of said semiconductor body is covered by said oxidation resistant mask;
- removing said oxidation resistant mask from said top surface of said semiconductor body;
- depositing a dielectric film adjacent to said grown oxide on said sidewalls of said semiconductor body and on the top surface of said semiconductor body;
- and
- forming a gate electrode above said gate dielectric on said top surface of said semiconductor body and adjacent to said deposited oxide on said laterally opposite sidewalls of said semiconductor body.
4 more elements
Dependencies are inferred from the claim text.