Labels for in-mold forming and molded resin products having the same
AssigneeYupo Corporation
InventorsTakatoshi Nishizawa, Masaki Shiina, Akihiko Ohno
Life of this patent
Estimating the term…
Abstract
Disclosed is a label for in-mold forming comprising a thermoplastic resin film base layer and a heat-seal resin layer, wherein a surface of the heat-seal resin layer has a centerline average roughness of 0.5 to 5 micrometers and the label has an air permeability of 10 to 20,000 seconds. When in-mold forming is conducted with the label of the present invention, labeled molded resin articles of various shapes can be manufactured while effectively inhibiting blistering.
Claims24
A label for in-mold forming comprising a thermoplastic resin film base layer and a heat-seal resin layer, wherein a surface of the heat-seal resin layer is embossed and has a centerline average roughness of 0.5 to 5 micrometers and the label has an air permeability of 10 to 20,000 seconds.
A labeled molded resin article in which a label, is integrally adhered to a molded resin article by thermal fusion, wherein the label comprises a thermoplastic resin film base layer and a heat-seal resin layer, a surface of the heat-seal resin layer is embossed and has a centerline average roughness of 0.5 to 5 micrometers and the label has an air permeability of 10 to 20,000 seconds.
Dependencies are inferred from the claim text.