Wireless IC interconnection method and system

A wireless integrated circuit (IC) interconnection system, comprising:

• a guided medium,
• a transmitter which modulates a signal to be conveyed from a first IC location to a second IC location and provides said modulated signal at an output,
• a first capacitive coupler which capacitively couples said modulated signal from said transmitter output to said wireless transmission medium,
• a second capacitive coupler which capacitively couples said modulated signal from said wireless transmission medium to a receiver, said wireless transmission medium propagating said modulated signal from said first capacitive coupler to said second capacitive coupler, and
• a receiver which demodulates said modulated signal and provides said demodulated signal to said second IC location,
• wherein said guided medium is a coplanar waveguide (CPW) having a characteristic impedance ZC, said CPW terminated at both ends with an impedance equal to ZC.

A wireless integrated circuit (IC) interconnection system, comprising:

• a wireless transmission medium,
• a plurality of transmitters, each of which modulates a respective signal to be conveyed from a first IC location to a second IC location and provides said modulated signal at an output,
• a first plurality of capacitive couplers, each of which capacitively couples a respective one of said modulated signals from its respective transmitter output to said wireless transmission medium,
• a second plurality of capacitive couplers, each of which capacitively couples said modulated signals from said wireless transmission medium to a respective receiver, said wireless transmission medium propagating said modulated signals from said first plurality of capacitive couplers to said second plurality of capacitive couplers, and
• a plurality of receivers, each of which demodulates a respective one of said modulated signals and provides said demodulated signal to said second IC location,
• wherein said wireless transmission medium is a microstrip transmission line (MTL) having a characteristic impedance ZC, said MTL terminated at both ends with an impedance equal to ZC.

A wireless integrated circuit (IC) interconnection system, comprising:

• a wireless transmission medium,
• a plurality of transmitters, each of which modulates a respective signal to be conveyed from a first IC location to a second IC location and provides said modulated signal at an output,
• a first plurality of capacitive couplers, each of which capacitively couples a respective one of said modulated signals from its respective transmitter output to said wireless transmission medium,
• a second plurality of capacitive couplers, each of which capacitively couples said modulated signals from said wireless transmission medium to a respective receiver, said wireless transmission medium propagating said modulated signals from said first plurality of capacitive couplers to said second plurality of capacitive couplers, and
• a plurality of receivers, each of which demodulates a respective one of said modulated signals and provides said demodulated signal to said second IC location,
• wherein said wireless transmission medium is a coplanar waveguide (CPW) having a characteristic impedance ZC, said CPW terminated at both ends with an impedance equal to ZC.

A method of conveying a signal from a first integrated circuit (IC) location to a second IC location, comprising:

• modulating said signal from said first IC location,
• capacitively coupling said modulated signal to a guided medium,
• propagating said capacitively coupled modulated signal through said guided medium,
• capacitively coupling said propagated modulated signal from said guided medium, and
• demodulating said modulated signal capacitively coupled from said guided medium and providing said demodulated signal to said second IC location,
• wherein said guided medium is a microstrip transmission line (MTL) having a characteristic impedance ZC, said MTL terminated at both ends with an impedance equal to ZC.

A method of conveying a signal from a first integrated circuit (IC) location to a second IC location, comprising:

• modulating said signal from said first IC location,
• capacitively coupling said modulated signal to a guided medium,
• propagating said capacitively coupled modulated signal through said guided medium,
• capacitively coupling said propagated modulated signal from said guided medium, and
• demodulating said modulated signal capacitively coupled from said guided medium and providing said demodulated signal to said second IC location,
• wherein said guided medium is a coplanar waveguide (CPW) having a characteristic impedance ZC, said CPW terminated at both ends with an impedance equal to ZC.

A method of conveying a plurality of signals from respective first integrated circuit (IC) locations to respective second IC locations, comprising:

• modulating each of said signals from said first IC locations,
• capacitively coupling each of said modulated signals to a wireless transmission medium,
• propagating said capacitively coupled modulated signals through said wireless transmission medium,
• capacitively coupling said propagated modulated signals from said wireless transmission medium,
• demodulating each of said modulated signals capacitively coupled from said wireless transmission medium and providing said demodulated signals to said second IC locations,
• wherein said wireless transmission medium is a microstrip transmission line (MTL) or a coplanar waveguide (CPW) having a characteristic impedance ZC, said MTL or CPW terminated at both ends with an impedance equal to ZC.

A wireless integrated circuit (IC) interconnection system, comprising:

• a guided medium,
• a transmitter which modulates a signal to be conveyed from a first IC location to a second IC location and provides said modulated signal at an output,
• a first capacitive coupler which capacitively couples said modulated signal from said transmitter output to said wireless transmission medium,
• a second capacitive coupler which capacitively couples said modulated signal from said wireless transmission medium to a receiver, said wireless transmission medium propagating said modulated signal from said first capacitive coupler to said second capacitive coupler, and
• a receiver which demodulates said modulated signal and provides said demodulated signal to said second IC location,
• wherein said guided medium is a microstrip transmission line (MTL) or a coplanar waveguide (CPW) having a characteristic impedance ZC, said MTL or CPW terminated at both ends with an impedance equal to ZC.

A wireless integrated circuit (IC) interconnection system, comprising:

• a wireless transmission medium,
• a plurality of transmitters, each of which modulates a respective signal to be conveyed from a first IC location to a second IC location and provides said modulated signal at an output,
• a first plurality of capacitive couplers, each of which capacitively couples a respective one of said modulated signals from its respective transmitter output to said wireless transmission medium,
• a second plurality of capacitive couplers, each of which capacitively couples said modulated signals from said wireless transmission medium to a respective receiver, said wireless transmission medium propagating said modulated signals from said first plurality of capacitive couplers to said second plurality of capacitive couplers, and
• a plurality of receivers, each of which demodulates a respective one of said modulated signals and provides said demodulated signal to said second IC location,
• wherein said wireless transmission medium is a microstrip transmission line (MTL) or a coplanar waveguide (CPW) having a characteristic impedance ZC, said MTL or CPW terminated at both ends with an impedance equal to ZC.

A method of conveying a signal from a first integrated circuit (IC) location to a second IC location, comprising:

• modulating said signal from said first IC location,
• capacitively coupling said modulated signal to a guided medium,
• propagating said capacitively coupled modulated signal through said guided medium,
• capacitively coupling said propagated modulated signal from said guided medium, and
• demodulating said modulated signal capacitively coupled from said guided medium and providing said demodulated signal to said second IC location,
• wherein said guided medium is a microstrip transmission line (MTL) or a coplanar waveguide (CPW) having a characteristic impedance ZC, said MTL or CPW terminated at both ends with an impedance equal to ZC.