Athermal package for fiber Bragg gratings with two or more bonding regions
AssigneeIntel Corporation
InventorsAlan E. Johnson, Edward P. Donlon, Frank D. Braun, Lap Van Hoang
Life of this patent
Estimating the term…
Abstract
An athermal package for fiber photonic devices includes at least two bonding regions at each end of the optical fiber containing the photonic device. At each end of the optical fiber, the bonding region nearest the photonic device (i.e., the inner bonding region) has a width that is less than that of the other bonding region (i.e., the outer bonding region). The smaller widths of the inner bonding regions allow for relatively precise control of the positions on the optical fiber that the inner bonding regions are attached. The larger widths of the outer bonding regions help provide reliable attachments.
Claims29
An apparatus, comprising:
- a package attachable to an optical fiber segment that includes a photonic device between first and second points on the optical fiber segment, the package having:
- a first bonding region attachable to the first point of the optical fiber segment;
- a second bonding region attachable to the optical fiber so that the first bonding region is between the second bonding region and the photonic device, a size of the first bonding region being less than and/or approximately equal to one-half a size of the second bonding region;
- a third bonding region attachable to the second point of the optical fiber segment;
- and
- a fourth bonding region attachable to the optical fiber so that the third bonding region is between the fourth bonding region and the photonic device, a size of the third bonding region being less than and/or approximately equal to one-half a size of the fourth bonding region.
An athermal package comprising
- first means for attaching an optical fiber to a first point on the optical fiber, the optical fiber including a photonic device between the first point and a second point on the optical fiber;
- second means for attaching the optical fiber to the athermal package, the first means for attaching being between the photonic device and the second means for attaching, the first means for attaching the optical fiber being less than and/or approximately equal to one-half a size of the second means for attaching the optical fiber;
- third means for attaching the optical fiber to the athermal package;
- and
- fourth means for attaching the optical fiber to the athermal package, the third means for attaching being located between the photonic device and the fourth means for attaching, the third means for attaching the optical fiber being less than and/or approximately equal to one-half a size of the fourth means for attaching the optical fiber.
A system, comprising:
- an optical signal source;
- an optical fiber coupled to the optical signal source;
- and
- a photonic device coupled to the optical fiber, wherein the photonic device is implemented between first and second points of a segment of optical fiber, the photonic device including a package attached to the optical fiber segment between the first and second points, the package having:
- a first bonding region attached to the first point of the optical fiber segment;
- a second bonding region attached to the optical fiber so that the first bonding region is between the second bonding region and the photonic device, a size of the first bonding region being less than and/or approximately equal to one-half a size of the second bonding region;
- a third bonding region attached to the second point of the optical fiber segment;
- and
- a fourth bonding region attached to the optical fiber so that the third bonding region is between the fourth bonding region and the photonic device, a size of the third bonding region being less than and/or approximately equal to one-half a size of the fourth bonding region.
Dependencies are inferred from the claim text.