System for monitoring oxidant concentration of slurry in a chemical mechanical polishing process
AssigneeMacronix International Co., Ltd.
InventorChi-Feng Cheng
Life of this patent
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Abstract
A system for monitoring oxidant concentration in a chemical mechanical polishing process, including a spectrometer and a central controller. The spectrometer is coupled to a conduit for supplying slurry between a slurry supply tub and a polishing table. The spectrometer is used to detect the oxidant concentration of the slurry. The central controller is coupled to the spectrometer, the slurry supply tub and the polishing table. The central controller is used to adjust the composition of the slurry in the slurry supply tub and the polishing condition of the polishing table according to the oxidant concentration of the slurry obtained from a signal transmitted by the spectrometer.
Claims19
A monitoring system for oxidant concentration of a slurry used in a chemical mechanical polishing system, the chemical mechanical polishing system comprising a slurry supply tub, a conduit and a polishing table, wherein the slurry is provided from the slurry supply tub to the polishing table through the conduit, the monitoring system comprising:
- a spectrometer, connected to the conduit to detect the oxidant concentration of the slurry using an optical method;
- and
- a central controller, connected to the spectrometer, the slurry supply tub and the polishing table, wherein the central controller adjusts a composition of the slurry and a polishing condition of the polishing table according to the oxidant concentration obtained from a signal transmitted from the spectrometer.
A chemical mechanical polishing system with a real time adjustment, comprising:
- a slurry supply tub, to carry a slurry comprising an oxidant;
- a polishing table, with a polishing pad thereon to polish a substrate;
- a conduit, to transport the slurry from the slurry supply tub to the polishing table;
- a spectrometer, connected to the conduit and using an optical method to detect an oxidant concentration of the slurry;
- and
- a central controller, connected to the spectrometer, the slurry supply tub and the polishing table, the central controller adjusting a composition of the slurry and a polishing condition of the polishing table according to the oxidant concentration obtained from a signal transmitted from the spectrometer.
Dependencies are inferred from the claim text.