High frequency composite switch module

A radio frequency (RF) hybrid switch module for switching between signals of a plurality of frequency bands, comprising:

• a dividing circuit
• a switching circuit;
• a low pass filter (LPF);
• an electrode pattern forming at least a portion of said dividing circuit, said switching circuit, and said LPF;
• a laminated body including a plurality of dielectric layers, said electrode pattern being formed on at least one of said dielectric layers;
• a surface acoustic wave (SAW) filter corresponding to the frequency bands, having a grounding port, being mounted on said laminated body;
• a diode mounted on said laminated body, for forming a portion of said switching circuit;
• a grounding electrode formed in said laminated body;
• and
• a via-conductor directly connecting said grounding port with said grounding electrode,
• wherein the frequency bands include first and second frequency bands,
• wherein at least one of said dividing circuit, switching circuit, and LPF includes first and second portions corresponding to the first and second frequency bands, respectively,
• wherein said SAW filter includes:
• a first SAW element corresponding to the first frequency band;
• and
• a second SAW element corresponding to the second frequency band, said first and second SAW elements being disposed adjacent each other substantially on a center of said laminated body,
• wherein said first portion is disposed in a first region of said laminated body near said first SAW element, and
• wherein said second portion is disposed in a second region of said laminated body near said second SAW element.

A radio frequency (RF) hybrid switch module for switching between signals of a plurality of frequency bands, comprising;

• a dividing circuit;
• a switching circuit;
• a low pass filter (LPF);
• an electrode pattern forming at least a portion of said dividing circuit, said switching circuit, and said LPF;
• a laminated body including a plurality of dielectric layers, said electrode pattern being formed on at least one of said dielectric layers;
• a surface acoustic wave (SAW) filter corresponding to the frequency bands, having a grounding port, being mounted on said laminated body;
• a diode mounted on said laminated body, for forming a portion of said switching circuit;
• a grounding electrode formed in said laminated body;
• a via-conductor directly connecting said grounding port with said grounding electrode;
• a first transmitting terminal formed on said laminated body;
• a first receiving terminal formed on said laminated body;
• a second transmitting terminal formed on said laminated body;
• and
• a second receiving terminal formed on said laminated body,
• wherein the frequency bands include first and second frequency bands,
• wherein said first transmitting terminal and said first receiving terminal correspond to the first frequency band,
• wherein said second transmitting terminal and said second receiving terminal correspond to the second frequency band,
• wherein said SAW filter includes:
• a first SAW element corresponding to the first frequency band;
• and
• a second SAW element corresponding to the second frequency band, said first and second SAW elements disposed adjacent to each other substantially on a center of said laminated body,
• wherein said first transmitting terminal and said first receiving terminal are formed in a first region of said laminated body near said first SAW element, and
• wherein said second transmitting terminal and said second receiving terminal are formed in a second region of said laminated body near said second SAW element.

A radio frequency (RF) hybrid switch module for switching between signals of a plurality of frequency bands, comprising:

• a dividing circuit;
• a switching circuit;
• a low pass filter (LPF);
• an electrode pattern forming at least a portion of said dividing circuit, said switching circuit, and said LPF;
• a laminated body including a plurality of dielectric layers, said electrode pattern being formed on at least one of said dielectric layers,
• a surface acoustic wave (SAW) filter corresponding to the frequency bands, having a grounding port, being mounted on said laminated body;
• a diode mounted on said laminated body, for forming a portion of said switching circuit;
• a grounding electrode formed in said laminated body;
• a via-conductor directly connecting said grounding port with said grounding electrode;
• a first transmitting terminal formed on said laminated body;
• a first receiving terminal formed on said laminated body;
• a second transmitting terminal formed on said laminated body;
• and
• a second receiving terminal formed on said laminated body,
• wherein the frequency bands include first and second frequency bands,
• wherein said first transmitting terminal and said first receiving terminal correspond to the first frequency band,
• wherein said second transmitting terminal and said second receiving terminal correspond to the second frequency band,
• wherein said SAW filter includes:
• a first SAW element corresponding to the first frequency band;
• and
• a second SAW element corresponding to the second frequency band, said first and second SAW elements being disposed adjacent to each other on a side of said laminated body in parallel with said side,
• wherein said first transmitting terminal and said first receiving terminal are formed in a first region of said laminated body near said first SAW element, and
• wherein said second transmitting terminal and said second receiving terminal are formed in a second region of said laminated body near said second SAW element.

A radio frequency (RF) hybrid switch module for switching between signals of a plurality of frequency bands, comprising:

• a dividing circuit;
• a switching circuit;
• a low pass filter (LPF);
• an electrode pattern forming at least a portion of said dividing circuit, said switching circuit, and said LPF;
• a laminated body Including a plurality of dielectric layers, said electrode pattern being formed on at least one of said dielectric layers;
• a surface acoustic wave (SAW) filter corresponding to the frequency bands, having a grounding port, being mounted on said laminated body;
• a diode mounted on said laminated body, for forming a portion of said switching circuit
• a grounding electrode formed in said laminated body;
• and
• a via-conductor directly connecting said grounding port with said grounding electrode,
• wherein said electrode pattern includes spiral electrode patterns formed in an identical spiral direction, said spiral electrode patterns adjoining to each other.

A radio frequency (RF), hybrid switch module for switching between signals of a plurality of frequency bands, comprising:

• a dividing circuit;
• a switching circuit;
• a low pass filter (LPF);
• an electrode pattern forming at least a portion of said dividing circuit, said switching circuit, and said LPF;
• a laminated body Including a plurality of dielectric layers, said electrode pattern being formed on at least one of said dielectric layers;
• a surface acoustic (SAW) filter corresponding to the frequency bands, having a grounding port, being mounted on said laminated body;
• a diode mounted on said laminated body, for forming a portion of said switching circuit;
• a grounding electrode formed in said laminated body;
• and
• a via-conductor directly connecting said grounding port with said grounding electrode,
• wherein said electrode pattern includes:
• a first electrode pattern relating to a receiving function of said dividing circuit switching circuit, and LPF;
• and
• a second electrode pattern relating to a transmitting function of said dividing circuit, switching circuit, and LPF,
• wherein said first electrode pattern is formed on a first dielectric layer of said dielectric layers,
• wherein said second electrode pattern is formed on a second dielectric layer of said dielectric layers, said second dielectric layer being farther from said grounding electrode than said first dielectric layer.

A radio frequency (RF) hybrid switch module for switching between signals of a plurality of frequency bands, comprising:

• a dividing circuit;
• a switching circuit;
• a low pass filter (LPF);
• an electrode pattern forming at least a portion of said dividing circuit, said switching circuit, and said LPF;
• a laminated body including a plurality of dielectric layers, said electrode pattern being formed on at least one of said dielectric layers;
• a surface acoustic wave (SAW) filter corresponding to the frequency bands, having a grounding port, being mounted on said laminated body;
• diode mounted on said laminated body, for forming a portion of said switching circuit;
• a grounding electrode formed in said laminated body;
• and
• a via-conductor directly connecting said grounding pert with said grounding electrode,
• wherein at least one of said dividing circuit, said switching circuit, and said LPF includes:
• a first capacitor electrode on a first dielectric layer of said dielectric layers;
• and
• a second capacitor electrode on a second dielectric layer of said dielectric layers, said second dielectric layer being nearer to said grounding electrode than said first dielectric layer;
• wherein said second capacitor electrode is nearer a ground in a equivalent circuit of said at least one of said dividing circuit, said switching circuit, and said LPF than said first capacitor electrode and
• wherein said first capacitor electrode has a different size from said second capacitor electrode.