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US 6,856,164 B2Granted
Semiconductor integrated circuit having on-chip termination
AssigneeSamsung Electronics Co., Ltd.
InventorsYoun-Sik Park, Chang-Man Khang
Life of this patent
Estimating the term…
Abstract
A semiconductor integrated circuit includes at least one pad coupled to a bus line, a transmitter for transmitting a signal from an internal circuit to the outside through the pad, and a termination circuit for terminating the bus line. The transmitter and the termination circuit are disposed to surround the pad, reducing a size of the semiconductor integrated circuit.
Claims11
A semiconductor integrated circuit comprising:
- at least one pad coupled to at least one bus line;
- a transmitter for transmitting a signal from an internal circuit externally via the at least one pad;
- and
- a termination circuit for terminating the at least one bus line,
- wherein the transmitter and the termination circuit are disposed to surround the at least one pad.
2 more elements
A semiconductor integrated circuit comprising:
- a bus line;
- a s rectangular pad coupled to the bus line, the rectangular pad having four sides including a first side, second side, third side and fourth side;
- a transmitter for transmitting a signal from an internal circuit externally via the rectangular pad;
- and
- a termination circuit for terminating the bus line,
- wherein the transmitter is disposed to fact the first and second sides of the rectangular pad, and the termination circuit is disposed to the third and fourth sides of the rectangular pad.
3 more elements
A semiconductor integrated circuit comprising:
- at least on pad coupled to at least one bus line;
- a transmitter for transmitting a signal from an internal circuit externally via the pad, the transmitter and the termination circuit including a plurality of pull-up transistors coupled between a power supply voltage and the pad in parallel and a plurality of pull-down transistors coupled between the pad and a ground voltage in parallel;
- and
- a termination circuit for terminating the bus line, the termination circuit including a plurality of pull-up resistors coupled between the power supply voltage and the pad in parallel and a plurality of pull-down resistors coupled between the pad and the ground voltage in parallel,
- wherein the plurality of pull-up transistors in the transmitter and the plurality of pull-up resistors in the termination circuit are disposed in a first region to surround a portion of the pad, and the plurality of pull-down transistors in the transmitter and the plurality of pull-down resistors in the termination circuit are disposed in a second region to surround a remaining portion of the pad.
2 more elements
Dependencies are inferred from the claim text.