Method and device for testing electronic devices
AssigneeHeatron, Inc.
InventorsRobert H. Martter, Craig C. Sundberg, Richard N. Giardina, Brian S. Fetscher, G. James Deutschlander
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Abstract
The present invention provides a new electronic circuit board and a method of using such board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10 μAmps at 350° C.
Claims11
A method of conducting the high temperature testing of an electronic device comprising the steps of:
- (i) providing an electronic circuit board for supporting and supplying current to the device to be tested, said electronic circuit board comprising a steel base coated with a dielectric material coating;
- (ii) providing electric current to the electronic circuit board;
- and
- (iii) heating the electronic circuit board to a temperature of from about 350° C. to about 500° C.
Dependencies are inferred from the claim text.