Methods and apparatus for testing and burn-in of semiconductor devices

A test apparatus comprising:

• a plurality of adapters removeably secured to a test board, each of said adapters including a plurality of test contacts arranged in a pattern configured to interface with a plurality of devices having a predetermined pattern of terminals;
• a device holding apparatus to which said plurality of devices are removeably secured such that said predetermined pattern of terminals on said devices corresponds to said plurality of test contacts on said plurality of adapters;
• a positioning subassembly configured to move said device holding apparatus to bring said predetermined pattern of terminals in contact with said plurality of test contacts;
• an external test device electrically coupled to said test board, said external test device configured to subject said plurality of devices to electrical testing.

A method of testing ball-grid array devices of the type having an array of solder balls attached thereto, said method comprising the steps of:

• providing a plurality of adapters removeably secured to a test board, each of said adapters including a plurality of test contacts arranged in an array corresponding to said array of solder balls, said test contacts electrically coupled to said test board, said test board electrically coupled to an external test system;
• removably attaching said plurality of ball-grid array devices to a flexible tape such that said array of solder balls on said devices corresponds to said test contacts on said plurality of adapters, wherein said flexible tape is secured to a carrier;
• positioning said carrier and said flexible tape to bring said plurality of solder balls in contact with said plurality of test contacts;
• and
• activating said external test system to test said ball grid array devices.

A ball-grid array test apparatus for testing ball-grid array devices of the type having a predetermined pattern of solder balls attached thereto, said ball-grid array test apparatus comprising:

• a test board having a clamp subassembly and a connector, said connector configured to provide electrical connectivity between said test board and an external test system
• a regular array of test adapters removeably secured to said test board, each of said adapters including a plurality of test contacts arranged in a pattern corresponding to said predetermined pattern of solder balls, wherein said test contacts are electrically coupled to said test board;
• a carrier supporting a flexible tape having an adhesive surface;
• a positioning system for attaching said plurality of ball-grid array devices to said adhesive surface such that said predetermined pattern of solder balls on said devices corresponds to said test contacts on said plurality of adapters, wherein said flexible tape is secured to said carrier;
• said clamp subassembly configured to position said carrier and said flexible tape to bring said plurality of solder balls in contact with said plurality of test contacts.

A test apparatus comprising:

• adapting means for providing a test contact pattern, said test contact pattern configured to interface with devices having a predetermined pattern of terminals;
• device holding means for removeably securing said devices such that said predetermined pattern of terminals on said devices corresponds to said test contact pattern on said adapting means;
• positioning means for moving said device holding means to bring said predetermined pattern of terminals in contact with said test contact pattern;
• testing means for subjected said devices to electrical testing, said testing means electrically coupled to said device holding means.