Test board for testing IC package and tester calibration method using the same

A system for testing an integrated circuit device under test (DUT) having terminals, said system comprising:

• an automatic test equipment (ATE);
• a calibration apparatus having contact probes for calibrating the ATE and having a test probe for checking an operational state of the calibration apparatus;
• and
• a test board comprising (a) a socket, which is electrically connected to the ATE, and which includes a plurality of contact terminals which are configured to directly contact the terminals of the DUT during a test operation and to directly contact the contact probes of the calibration apparatus during a calibration operation, (b) an alignment mark which is positioned adjacent the socket and which can be sensed by the calibration apparatus during the calibration operation, and (c) a test pad which is positioned adjacent the socket and which is configured to directly contact the test probe of the calibration apparatus.

A method of calibrating an automatic test equipment (ATE) which tests an integrated circuit device under test (DUT) having terminals, said method comprising:

• electrically connecting the ATE to a socket of a test board, the socket including a plurality of contact terminals which are configured to directly contact the terminals of the DUT during a test operation;
• using an alignment mark positioned adjacent the socket to align a calibration apparatus with the test board;
• directly contacting a test pad positioned adjacent the socket with a test probe of the calibration apparatus to determine whether the calibration apparatus is operating correctly;
• and
• directly contacting the contact terminals of the socket with calibration probes of the calibration apparatus to detect calibration data for calibrating the ATE.