Conductive polymer contact system and test method for semiconductor components

A contact system for a semiconductor component having a plurality of terminal contacts comprising:

• a board comprising a plurality of contacts in electrical communication with external circuitry and a plurality of pins;
• a substrate slidably mounted on the pins having a plurality of flexible segments configured to move independently of one another;
• a plurality of contactors on the flexible segments configured to simultaneously electrically engage the contacts and the terminal contacts;
• each contactor comprising a first contact on a first side of a flexible segment configured to electrically engage a terminal contact, a second contact on a second side of the flexible segment in electrical communication with the first contact, and a conductive polymer layer configured to electrically engage the second contact and a contact.

A contact system for a semiconductor component having a plurality of terminal contacts comprising:

• a board comprising a plurality of contacts in electrical communication with an external circuitry;
• a substrate slidably mounted to the board for movement in a z-direction and having a first side, an opposing second side, and a plurality of grooves from the first side to the second side forming a plurality of flexible segments;
• a plurality of contactors on the flexible segments configured to move independently of one another and to simultaneously electrically engage the contacts and the terminal contacts;
• each contactor comprising a first contact on the first side of a flexible segment configured to electrically engage the terminal contact, a second contact on the second side of the flexible segment in electrical communication with the first contact, and a conductive polymer layer configured to electrically engage the second contact and a contact.

A contact system for a semiconductor component having a plurality of terminal contacts comprising:

• a test circuitry configured to apply test signals to the component;
• a test handler configured to move and support the component;
• a board comprising a plurality of contacts in electrical communication with the test circuitry;
• a substrate on the board comprising a plurality of independent flexible segments and a plurality of contactors on the flexible segments configured under a force applied by the test handler to the component to simultaneously electrically engage the contacts and the terminal contacts;
• each contactor comprising a first contact on a first side of a flexible segment configured to electrically engage a terminal contact on the component, and a second contact on a second opposing side of the flexible segment in electrical communication with the first contact, and a conductive polymer layer configured to electrically engage the second contact and a contact on the board.