Process independent alignment marks
AssigneeLSI Logic Corporation
InventorsDavid W. Daniel, James R. B. Elmer
Life of this patent
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Abstract
An integrated circuit substrate having a first surface for receiving a series of aligned layers during the creation of the integrated circuit, and a second surface disposed substantially opposite the first surface, where the second surface has at least one alignment mark for aligning the series of aligned layers one to another during creation of the integrated circuit. An apparatus for aligning a mask having an image and at least one complimentary alignment mark to a substrate having a first surface and a substantially opposing second surface, where the substrate has at least one alignment mark on the second surface.
Claims6
An integrated circuit substrate comprising:
- a first surface adapted for receiving a series of aligned layers during the creation of the integrated circuit, the first surface having no layers formed thereon, and
- a second surface disposed substantially opposite the first surface, the second surface having no layers formed thereon and at least one alignment mark formed thereon, the at least one alignment mark adapted for aligning the series of aligned layers one to another during the creation of the integrated circuit.
Dependencies are inferred from the claim text.