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US 6,856,017 B2Granted
Device having resin package and method of producing the same
AssigneeFujitsu Limited
InventorsYoshiyuki Yoneda, Kazuto Tsuji, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto, Masanori Onodera, Junichi Kasai
Life of this patent
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Abstract
A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.
Claims19
A device comprising:
- a chip formed on a die-bonding resin layer;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said projections projecting from a bottom surface of said device;
- metallic films respectively provided to bottom and side surfaces of the resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- said die-bonding resin layer being exposed to outside at said bottom surface of said device,
- wherein each of said metallic films is a single layer made of a metallic substance.
4 more elements
A device comprising:
- a chip formed on a die-bonding resin layer;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said projections projecting from a bottom surface of said device;
- metallic films respectively provided to bottom and side surfaces of the resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- said die-bonding resin layer being exposed to outside at said bottom surface of said device
- wherein:
- said connecting parts respectively comprise bonding wires, and bonding balls respectively provided to the metallic films;
- and
- said bonding wires are bonded to said electrode pads and said bonding balls.
7 more elements
A device comprising:
- a chip;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said projections projecting from a bottom surface of said device;
- metallic films respectively provided to bottom and side surfaces of the resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- wherein said resin package includes a first resin portion on which the chip is provided, and a second resin portion which covers the chip,
- said first resin portion being exposed to outside at said bottom surface of said device at said bottom surface of said device.
4 more elements
A device comprising:
- a chip formed on a die-bonding resin layer;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said resin projections extending downwards from the mount-side surface and laterally extending from at least one side surface of the resin package;
- metallic films respectively provided to bottom and side surfaces of the resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- said die-bonding resin layer being exposed at said mount-side surface,
- wherein each of said metallic films is a single layer made of a metallic substance.
4 more elements
A device comprising:
- a chip formed on a die-bonding resin layer;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said resin projections extending downwards from the mount-side surface and laterally extending from at least one side surface of the resin package;
- metallic films respectively provided to bottom and side surfaces of the resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- said die-bonding resin layer being exposed at said mount-side surface,
- wherein:
- said connecting parts respectively comprise bonding wires, and bonding balls respectively provided to the metallic films;
- and
- said bonding wires are bonded to said electrode pads and said bonding balls.
7 more elements
A device comprising:
- a chip formed on a die-bonding resin layer;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said resin projections extending downwards from the mount-side surface and laterally extending from at least one side surface of the resin package;
- metallic films respectively provided to bottom and side surfaces of the resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- said die-bonding resin layer being exposed at said mount-side surface,
- wherein said resin projections laterally extend from a plurality of side surfaces of said resin package.
4 more elements
A device comprising:
- a chip formed on a die-bonding resin layer;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said resin projections extending downwards from the mount-side surface and laterally extending from at least one side surface of the resin package;
- metallic films respectively provided to bottom and side surfaces of the resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- said die-bonding resin layer being exposed at said mount-side surface,
- wherein said resin projections laterally extend from only one side surface of said resin package.
4 more elements
A device comprising:
- a chip formed on a die-bonding resin layer;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said projections projecting from a bottom surface of said device;
- metallic films respectively provided to bottom and side surfaces of the resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- said die-bonding resin layer being exposed at said mount-side surface,
- wherein:
- said connecting members respectively comprise bumps provided between the electrode pads of the chip and the metallic films.
5 more elements
A device comprising:
- a chip formed on a die-bonding resin layer;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said projections projecting from a bottom surface of said device;
- metallic films respectively provided to bottom and side surfaces of the resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- said die-bonding resin layer being exposed at said bottom surface,
- wherein:
- said metallic films respectively have lead portions, which are sealed by the resin package and extend toward the chip;
- and
- said connecting parts include bumps provided between the electrode pads of the chip and the lead portions of the metallic films.
7 more elements
A device comprising:
- a chip formed on a die-bonding resin layer;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said projections projecting from a bottom surface of said device;
- metallic films respectively provided to bottom and side surfaces of the resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- said die-bonding resin layer being exposed at said bottom surface,
- wherein:
- said metallic films respectively have lead portions, which are sealed by the resin package and extend toward the chip, said lead portions having recess portions;
- and
- said connecting parts include bumps, which are positioned in said recess portions and are provided between the electrodes pads of the chip and the lead portions of the metallic films.
7 more elements
Dependencies are inferred from the claim text.