Semiconductor package with heat sink

A semiconductor package with a heat sink, comprising:

• a substrate having a top surface and a bottom surface;
• at least one chip mounted on the top surface of the substrate and electrically connected to the substrate;
• the heat sink mounted on the top surface of the substrate for covering the chip, the heat sink having a flat portion and a support portion connected to the flat portion, wherein the support portion has at least one recess portion facing toward the top surface of the substrate, and at least one burr is formed on an interior surface of the recess portion;
• an adhesive material applied between the support portion of the heat sink and the top surface of the substrate to substantially fill the recess portion and submerge the burr, so as to attach the heat sink to the substrate by means of the adhesive material;
• and
• a plurality of solder balls implanted on the bottom surface of the substrate.