Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit

An integrated circuit package comprising:

• a substrate having opposing first and second substrate surfaces and at least one electrical connection supported by the first substrate surface and adapted to couple with circuitry external of the package;
• a semiconductor die including:
• circuitry electrically coupled with the at least one electrical connection;
• a first die surface coupled with the second substrate surface;
• and
• a second die surface;
• a cover received adjacent the second die surface;
• and
• an adhesive adhered to the cover and the second die surface;
• wherein the cover is substantially thermally insulated from the semiconductor die.

An integrated circuit package comprising:

• a substrate having opposing first and second substrate surfaces;
• at least one electrical connection supported by the first substrate surface and adapted to couple with circuitry external of the package;
• a semiconductor die including:
• circuitry electrically coupled with the at least one electrical connection;
• a first die surface coupled with the second substrate surface;
• and
• a second die surface;
• and
• a cover coupled with the second die surface;
• wherein the cover is substantially thermally insulated from the semiconductor die.

An integrated circuit package comprising:

• an electrically insulative substrate having opposing first and second substrate surfaces;
• at least one electrical connection supported by the first substrate surface and adapted to couple with circuitry external of the package;
• a semiconductor die including:
• circuitry electrically coupled with the at least one electrical connection;
• a first die surface coupled with the second substrate surface;
• and
• a second die surface;
• a cover coupled with and directly contacting the second die surface;
• wherein the cover comprises a ground plane;
• and
• wherein the cover is substantially thermally insulated from the semiconductor die.

An integrated circuit package comprising:

• an electrically insulative substrate having opposing first and second substrate surfaces;
• at least one electrical connection supported by the first substrate surface and adapted to couple with circuitry external of the package;
• a semiconductor die including:
• circuitry electrically coupled with the at least one electrical connection;
• a first die surface coupled with the second substrate surface;
• and
• a second die surface;
• a ground plane directly contacting the second die surface;
• wherein at least a portion of the first die surface overlies at least a portion of the second substrate surface;
• and
• wherein the ground plane is substantially thermally insulated from the semiconductor die.