Techniques for packaging multiple device components

A stacked package comprising:

• a multi-chip package comprising:
• a carrier;
• a first integrated circuit die coupled to the carrier;
• a second integrated circuit die coupled to the carrier;
• an encapsulant disposed about each of the first integrated circuit die and the second integrated circuit die;
• and
• a plurality of conductive elements coupled between an outer surface of the encapsulant and each of the first integrated circuit die and the second integrated circuit die;
• and
• a first integrated circuit module comprising:
• an interposer having a first side and a second side and a plurality of conductive vias therethrough, and comprising a conductive trace layer electrically coupled to the conductive vias, wherein the first side of the interposer is coupled to the multi-chip package such that each of the plurality of conductive vias is aligned with a respective one of the plurality of conductive elements;
• a third integrated circuit die coupled to the second side of the interposer, wherein the third integrated circuit die is electrically coupled to the conductive trace layer;
• and
• a fourth integrated circuit die coupled to the second side of the interposer;
• wherein the fourth integrated circuit die is electrically coupled to the conductive trace layer.