US 6,856,008 B2 · Laminated multilayer package

Abstract

The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two HLC substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). An adhesive film may be positioned between the surfaces of the HLC substrates having the conductive pads, where the adhesive film includes an aperture located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The HLC substrates then may be pressed together to mechanically bond the two substrates via the adhesive. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the two conductive pads through the aperture in the adhesive film.

Claims41

Dependent claims

A multilayer package comprising:

a first substrate including:
a first conductive pad and a first conductive layer disposed in the first substrate;
and
a first via extending through at least a portion of the first substrate and providing an electrical connection between the first conductive pad and the first conductive layer;
a second substrate including:
a second conductive pad and a second conductive layer disposed in the second substrate;
and
a second via extending through at least a portion of the second substrate and providing an electrical connection between the second conductive pad and the second conductive layer;
an adhesive film disposed between the first substrate and the second substrate and having an aperture located at least in part between the first and second conductive pads, the adhesive film mechanically bonding the first substrate and the second substrate;
and
a solder segment occupying at least a substantial portion of the aperture in the adhesive film and providing an electrical connection between the first conductive pad and the second conductive pad, the solder segment being formed at least in part by a reflow of solder paste applied to the first conductive pad.

8 more elements

A multilayer package comprising:

a first substrate including:
a first conductive pad and a first conductive layer disposed in the first substrate, the first conductive pad comprising a first pad section connected to a second pad section by a first connective portion;
and
a first via extending through at least a portion of the first substrate to the first pad section and providing an electrical connection between the first conductive pad and the first conductive layer;
a second substrate including:
a second conductive pad and a second conductive layer disposed on the second substrate;
and
a second via extending through at least a portion of the second substrate and providing an electrical connection between the second conductive pad and the second conductive layer;
an adhesive film disposed between the first substrate and the second substrate and having an aperture located substantially between the second pad section of the first conductive pad and the second conductive pad, the adhesive film mechanically bonding the first substrate and the second substrate;
and
a solder segment occupying at least a substantial portion of the aperture in the adhesive film and providing an electrical connection between the first conductive pad and the second conductive pad, the solder segment being formed at least in part by a reflow of a solder bump formed on the second pad section.

8 more elements

Dependencies are inferred from the claim text.

Laminated multilayer package

Life of this patent

Laminated multilayer package

Life of this patent

Abstract

Claims41