Electronic device substrate structure and electronic device

An electronic device substrate structure comprising:

• a substrate at least having asurface made of Si(100) single crystal;
• a metal thin film having a face-centered cubic structure or a hexagonal closest packed structure and formed on said substrate, said metal thin film being selected from the group consisting of a (111)-oriented film of a face-centered cubic structure having a (111) plane oriented in parallel to said substrate surface, and a (0001)-oriented film of a hexagonal closest packed structure having a (0001) plane oriented in parallel to said substrate surface;
• and
• a wurtzite type thin film having a wurtzite crystal structure and formed on said metal thin film, said wurtzite type thin film is a (0001)-oriented film having a (0001) plane oriented in parallel to said substrate surface;
• wherein each of said metal thin film and said wurtzite type thin film is a polycrystalline film containing at least two kinds of crystal grains different in direction of crystal orientation in the plane;
• when said metal thin film is a (111)-oriented film, said wurtzite type thin film is epitaxially grown on said metal thin film so that <11-20> axes in the plane of said wurtzite type thin film are parallel to <1-10> axes in the plane of said metal thin film;
• and
• when said metal thin film is a (0001)-oriented film, said wurtzite type thin film is epitaxially grown on said metal thin film so that <11-20> axes in the plane of said wurtzite type thin film are parallel to <11-20> axes in the plane of said metal thin film.