Semiconductor device and semiconductor package
AssigneeHitachi, Ltd.
InventorsAkira Nagai, Satoru Amou, Shinji Yamada, Takao Ishikawa, Hiroshi Nakano
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Abstract
A semiconductor device wherein a resin containing as a cross-linking component a compound having a plurality of styrene group and represented by chemical formula [1] is used as an insulating material: where R is a hydrocarbon structure which may have a substituent group or groups, R1 is hydrogen, methyl, or ethyl, m is and integer of 1 to 4, and n is an integer of not less than 2. With this, a semiconductor device and a semiconductor package which show excellent transmission characteristics and less power consumption are provided.
Claims16
A semiconductor device wherein a resin containing as a cross-linking component a monomer having a plurality of styrene groups and a melting point of not more than 100° C., and represented by chemical formula [1], is used as an insulating material:
- where R is a hydrocarbon structure which may have a substituent group or groups, R1 is hydrogen, methyl, or ethyl, m is an integer of 1 to 4, and n is an integer of not less than 2.
A semiconductor package wherein a resin containing as a cross-linking component a monomer having a plurality of styrene groups and a melting point of not more than 100° C. and represented by chemical formula [1], is used for forming a re-wiring layer or an insulating interlayer:
- where R is a hydrocarbon structure which may have a substituent group or groups, R1 is hydrogen, methyl, or ethyl, m is an integer of 1 to 4, and n is an integer of not less than 2.
A semiconductor package wherein a resin containing as a cross-linking agent a monomer having a plurality of styrene groups and a melting point of not more than 100° C., and represented by chemical formula [1] is used for forming a chip protective layer or a wiring protective layer:
- where R is a hydrocarbon structure which may have a substituent group or groups, R1 is hydrogen, methyl, or ethyl, m is an integer of 1 to 4, and n is an integer of not less than 2.
Dependencies are inferred from the claim text.