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US 6,855,637 B2Granted
Method for manufacturing surface acoustic wave device
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKiyoharu Yamashita, Kazuo Ikeda, Shunichi Seki, Mitsuhiro Furukawa
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Abstract
Provided is a method of manufacturing surface acoustic wave (SAW) devices having a first conductive pattern and a second conductive pattern of different thicknesses on one piezoelectric substrate. Combination of a plurality of steps of forming metal films and etching steps allows accurate production of SAW devices having a plurality of electrodes of different thicknesses on one piezoelectric substrate.
Claims28
A method of manufacturing a surface acoustic wave (SAW) device comprising steps of:
- forming a first metal film on a piezoelectric substrate;
- forming a bottom part of a first conductive pattern by etching the first metal film;
- forming a second metal film on a side of the piezoelectric substrate having the bottom part of the first conductive pattern;
- forming a third metal film on the second metal film;
- and
- forming the first conductive pattern and a second conductive pattern by etching the first metal film, the second metal film and the third metal film.
3 more elements
Dependencies are inferred from the claim text.