Manufacturing method of multilayer substrate

A manufacturing method of a multilayer substrate, comprising:

• laminating single-sided conductor patterned films in a stack, each of which has a resin film, a conductor pattern formed only on a single side of the resin film, and a via hole formed at a predetermined location and filled with an interlayer connection material, wherein an exposed conductor pattern of a one of the films located on a first side of the stack, is formed as a first conductive foil that entirely covers the resin film of the one film;
• forming a second conductive foil on a surface resin film that is on a second side of the stack, so as to cover the surface resin film entirely;
• and
• patterning the first and second conductive foils to form first and second conductor patterns, wherein electrodes are formed by the first and second conductor patterns, and the lamination forms a multilayer substrate.

A manufacturing method of a multilayer substrate, comprising:

• laminating single-sided conductor patterned films, each of which has a resin film, a conductor pattern formed only on a single side of the resin film, and a via hole formed at a predetermined location and filled with an interlayer connection material;
• and
• adhering the single-sided conductor patterned films to each other using heat without adhesive to form a multilayer substrate, wherein:
• an arbitrary two of the single-sided conductor patterned films are laminated so that surfaces thereof on which the conductor patterns are not formed face each other, while the remaining single-sided conductor patterned films are laminated in such a manner that a surface on which the conductor pattern is formed and a surface on which the conductor pattern is not formed face each other, whereby electrodes are formed by the conductive patterns at both sides of the multilayer substrate;
• and
• the resin film is composed of a thennoplastic resin;
• the single-sided conductor patterned films are laminated after conductor patterns on all of the single-sided conductor patterned films are patterned into predetermined shapes;
• and;
• the respective single-sided conductor patterned films are adhered to each other by pressing the multilayer substrate from opposite sides while heating.

A manufacturing method of a multilayer substrate, comprising:

• laminating single-sided conductor patterned films, each of which has a resin film, a conductor pattern formed only on a single side of the resin film, and a via hole formed at a predetermined location and filled with an interlayer connection material;
• and
• adhering the single-sided conductor patterned films to each other to form a multilayer substrate, wherein:
• an arbitrary two of the single-sided conductor patterned films are laminated so that surfaces thereof on which no conductor patterns are formed face each other, while the remaining single-sided conductor patterned films are laminated in such a manner that a surface on which the conductor pattern is formed and a surface on which no conductor pattern is formed face each other, whereby electrodes are formed by the conductive patterns at two, opposite sides of the multilayer substrate;
• via holes of the single-sided conductor patterned films of which surfaces of the resin films having no conductive pattern face each other, are formed approximately in an elliptical shape;
• and
• said elliptical-shaped via holes are overlapped with each other so that longitudinal axes thereof are orthogonal to one another.

A manufacturing method of a multilayer substrate, comprising:

• laminating single-sided conductor patterned films, each of which has a resin film, a conductor pattern formed only on a single side of the resin film, and a via hole formed at a predetermined location and filled with an interlayer connection material;
• and
• adhering the single-sided conductor patterned films to each other to form a multilayer substrate, wherein:
• an arbitrary two of the single-sided conductor patterned films are laminated so that surfaces thereof on which no conductor patterns are formed face each other, while the remaining single-sided conductor patterned films are laminated in such a manner that a surface on which the conductor pattern is formed and a surface on which no conductor pattern is formed face each other, whereby electrodes are formed by the conductive patterns at two, opposite sides of the multilayer substrate;
• via holes of the two arbitrary films are formed in a radial shape having three or more linear portions that radially extend from a center portion, and
• the radial-shaped via holes are overlapped with each other.

A manufacturing method of a multilayer substrate, comprising:

• laminating single-sided conductor patterned films, each of which has a resin film, a conductor pattern formed only on a single side of the resin film, and a via hole formed at a predetermined location and filled with an interlayer connection material;
• and
• adhering the single-sided conductor patterned films to each other to form a multilayer substrate, wherein:
• an arbitrary two of the single-sided conductor patterned films are laminated so that surfaces thereof on which no conductor patterns are formed face each other, while the remaining single-sided conductor patterned films are laminated in such a manner that a surface on which the conductor pattern is formed and a surface on which no conductor pattern is formed face each other, whereby electrodes are formed by the conductive patterns at two, opposite sides of the multilayer substrate;
• via holes respectively formed in the single-sided conductor patterned films have an approximate circular shape;
• and
• the via holes of the two arbitrary films have a diameter larger than that of the via holes formed in the remaining single-sided conductor patterned films, and the via holes having a larger diameter are overlapped with each other when laminated.