Recessed tape and method for forming a BGA assembly

A method for attaching solder balls to a semiconductor device comprising:

• providing a heat-resistant polyimide tape, the polyimide tape having:
• a first side having a plurality of blind recesses in the tape;
• an adhesive coating applied to the first side to form a first adhesive surface, each blind recess having a second adhesive surface therein;
• inserting a solder ball into two or more blind recesses wherein the solder balls adhere to the second adhesive surface;
• securing the first adhesive surface of the polyimide tape by the first adhesive surface to a semiconductor device having a plurality of connection points, wherein the two or more blind recesses are aligned with two or more connection points;
• heating the solder balls to a temperature at which they reflow and bond to the connection points;
• cooling the solder balls;
• and
• removing the polyimide tape from the semiconductor device whereby the solder balls remain attached to the connection points to form a BGA.

A method for attaching solder balls to a semiconductor device comprising:

• providing a heat-resistant tape, the tape having:
• a first side having a plurality of blind recesses in the tape;
• an adhesive coating applied to the first side to form a first adhesive surface, each blind recess having a second adhesive surface therein;
• a removable liner coveting the first adhesive surface;
• and
• inserting a solder ball into two or more blind recesses wherein the solder balls adhere to the second adhesive surface;
• removing the liner from the first side, exposing the first adhesive surface;
• securing the first adhesive surface by the first adhesive surface to the semiconductor device, the device having a plurality of bond pads, wherein the plurality of blind recesses align with the plurality of bond pads;
• heating the semiconductor device to a temperature which reflows the solder balls;
• and
• removing the tape from the semiconductor device whereby the solder balls remain attached to the plurality of bond pads.

A method for attaching solder balls to a semiconductor device comprising:

• providing a heat-resistant tape, the heat-resistant tape having first adhesive surface, the first adhesive surface having a plurality of blind recesses in the tape formed in the first adhesive surface, each blind recess having a second adhesive surface therein;
• inserting a solder ball into a recess, wherein the solder ball adheres to the second adhesive surface;
• performing pattern recognition on the tape to determine if each recess that is to be filled with a solder ball is so filled;
• securing the first adhesive surface by the first adhesive surface to the semiconductor device, the device having a plurality of bond pads, wherein each blind recess containing a solder ball aligns with a bond pad;
• heating the solder ball to a temperature which reflows the solder balls;
• and
• separating the tape from the semiconductor device.

A method for attaching solder balls to semiconductor devices comprising:

• providing a sheet having a plurality of heat-resistant tape segments, each tape segment having a first adhesive surface, the first adhesive surface having a plurality of blind recesses in the tape segment formed in the first adhesive surface, each blind recess having a second adhesive surface therein;
• inserting a solder ball into a blind recess of each tape segment, wherein the solder ball adheres to the second adhesive surface;
• providing a plurality of semiconductor devices, each semiconductor device having a plurality of bond pads;
• securing each semiconductor device to the first adhesive surface of a tape segment, wherein each bond pad of each semiconductor device is aligned with a blind recess of a tape segment containing a solder ball, wherein each tape segment is adapted to secure to one semiconductor device;
• and
• heating the solder balls to a temperature at which they reflow and bond to the bond pads.

A method for attaching solder balls to semiconductor devices comprising:

• providing a sheet having a plurality of heat-resistant tape segments, each tape segment having a first adhesive surface, the first adhesive surface having a plurality of blind recesses in the tape segment formed on the first adhesive surface, each blind recess having a second adhesive surface therein;
• inserting a solder ball into a blind recess of each tape segment, wherein the solder ball adheres to the second adhesive surface;
• providing a plurality of semiconductor devices, each semiconductor device having a plurality of bond pads;
• securing each semiconductor device to the first adhesive surface of a tape segment, wherein each bond pad of each semiconductor device is aligned with a blind recess of a tape segment containing a solder ball, wherein each tape segment is adapted to secure to one semiconductor device;
• and
• heating the solder balls to a temperature at which they reflow and bond to the bond pads, wherein the method further includes separating each tape segment with a semiconductor device secured thereto from the sheet prior to heating the solder balls.

A method for attaching solder balls to semiconductor devices comprising:

• providing a sheet having a plurality of heat-resistant tape segments, each tape segment having a first adhesive surface, the first adhesive surface having a plurality of blind recesses in the tape segment formed on the first adhesive surface, each blind recess having a second adhesive surface therein;
• inserting a solder ball into a blind recess of each tape segment, wherein the solder ball adheres to the second adhesive surface;
• providing a plurality of semiconductor devices, each semiconductor device having a plurality of bond pads;
• securing each semiconductor device to the first adhesive surface of a tape segment, wherein each bond pad of each semiconductor device is aligned with a blind recess of a tape segment containing a solder ball, wherein each tape segment is adapted to secure to one semiconductor device;
• and
• heating the solder balls to a temperature at which they reflow and bond to the bond pads, wherein the method further includes separating each tape segment with a semiconductor device secured thereto from the sheet after heating the solder balls.

A method for attaching solder balls to semiconductor devices comprising:

• providing a sheet having a plurality of heat-resistant tape segments, each tape segment having a first adhesive surface, the first adhesive surface having a plurality of blind recesses in the tape segment formed on the first adhesive side, each blind recess having a second adhesive surface therein;
• inserting a solder ball into a blind recess of each tape segment, wherein the solder ball adheres to the second adhesive surface;
• providing a plurality of semiconductor devices, each semiconductor device having a plurality of bond pads;
• securing each semiconductor device to the first adhesive surface of a tape segment, wherein each bond pad of each semiconductor device is aligned with a blind recess of a tape segment, wherein each tape segment is adapted to secure to one semiconductor device;
• and
• separating a tape segment from the sheet.

A method for attaching solder balls to semiconductor devices comprising:

• providing a sheet having a plurality of heat-resistant tape segments, each tape segment having a first adhesive surface, the first adhesive surface having a plurality of blind recesses in the tape segment formed in the first adhesive surface, each blind recess having a second adhesive surface therein;
• coupling the sheet to an automated conveyor system to convey a tape segment to a solder ball placement apparatus;
• aligning the tape segment with the solder ball placement apparatus;
• inserting a solder ball from the solder ball placement apparatus into a blind recess of the aligned tape segment, wherein the solder ball adheres to the second adhesive surface;
• processing one or more additional tape segments through the alignment with the solder ball apparatus and the insertion of a solder ball from the solder ball placement apparatus into a blind recess of the aligned tape segment, wherein the solder ball adheres to the second adhesive surface;
• providing a plurality of semiconductor devices, each semiconductor device having a plurality of bond pads;
• securing each semiconductor device to the first adhesive surface of a tape segment, wherein each bond pad of each semiconductor device is aligned with a blind recess of a tape segment, wherein each tape segment is adapted to secure to one semiconductor device;
• and
• heating the solder balls to a temperature at which they reflow and bond to the bond pads.

A method for attaching solder balls to semiconductor devices comprising:

• providing a sheet having a plurality of heat-resistant tape segments, each tape segment having a first adhesive surface, the first adhesive surface having a plurality of blind recesses in the tape segment formed on the first adhesive side, each blind recess having a second adhesive surface therein;
• coupling the sheet to an automated conveyor system to convey a tape segment to a solder ball placement apparatus;
• aligning the tape segment with the solder ball placement apparatus;
• inserting a solder ball from the solder ball placement apparatus into a blind recess of the aligned tape segment, wherein the solder ball adheres to the second adhesive surface;
• processing one or more additional tape segments through the alignment with the solder ball apparatus and the insertion of a solder ball from the solder ball placement apparatus into a blind recess of the aligned tape segment, wherein the solder ball adheres to the second adhesive surface;
• providing a plurality of semiconductor devices, each semiconductor device having a plurality of bond pads;
• securing each semiconductor device to the first adhesive surface of a tape segment, wherein each bond pad of each semiconductor device is aligned with a blind recess of a tape segment, wherein each tape segment is adapted to secure to one semiconductor device;
• and
• heating the solder balls to a temperature at which they reflow and bond to the bond pads, wherein the method further includes separating each tape segment with a semiconductor device secured thereto from the sheet prior to heating the solder balls.

A method for attaching solder balls to semiconductor devices comprising:

• providing a sheet having a plurality of heat-resistant tape segments, each tape segment having a first adhesive surface, the first adhesive surface having a plurality of blind recesses in the tape segment formed on the first adhesive side, each blind recess having a second adhesive surface therein;
• coupling the sheet to an automated conveyor system to convey a tape segment to a solder ball placement apparatus;
• aligning the tape segment with the solder ball placement apparatus;
• inserting a solder ball from the solder ball placement apparatus into a blind recess of the aligned tape segment, wherein the solder ball adheres to the second adhesive surface;
• processing one or more additional tape segments through the alignment with the solder ball apparatus and the insertion of a solder ball from the solder ball placement apparatus into a blind recess of the aligned tape segment, wherein the solder ball adheres to the second adhesive surface;
• providing a plurality of semiconductor devices, each semiconductor device having a plurality of bond pads;
• securing each semiconductor device to the first adhesive surface of a tape segment, wherein each bond pad of each semiconductor device is aligned with a blind recess of a tape segment, wherein each tape segment is adapted to secure to one semiconductor device;
• and
• heating the solder balls to a temperature at which they reflow and bond to the bond pads, wherein the method further includes separating each tape segment with a semiconductor device secured thereto from the sheet after heating the solder balls.

A method comprising:

• forming a tape for attaching solder balls to an electronic component to form a ball grid array on the electronic component, forming the tape comprising:
• providing a heat-resistant film having a first side;
• forming a plurality of blind recesses in the first side in the heat-resistant film, each blind recess configured to hold at most one of the solder balls;
• applying a first adhesive coating to the first side to form a first adhesive surface, the first adhesive surface adapted to secure the heat-resistant film to the electronic component;
• applying a second adhesive coating to each blind recess to form a second adhesive surface therein;
• and
• forming a removable liner on the first adhesive surface, the removable liner having a plurality of perforations aligned with the plurality of blind recesses.

A method comprising:

• forming a tape for attaching solder balls to a semiconductor device to from a ball grid array on the semiconductor device, forming the tape comprising:
• providing a heat-resistant first layer having a first side and a second side;
• forming a plurality of perforations through the first layer;
• applying a first adhesive coating to the first side of the first layer to form a first adhesive surface, the first adhesive surface adapted to secure the heat-resistant first layer to the semiconductor device;
• providing a heat-resistant second layer having a third side;
• laminating the third side of the second layer to the second side of the first layer, wherein the perforations in the first layer and the third side of the second layer form a plurality of blind recesses, each blind recess configured to hold at most one of the solder balls;
• applying a second adhesive to each blind recess forming a second adhesive surface therein;
• and
• forming a removable liner on the first adhesive surface, the removable liner having a plurality of perforations aligned with the plurality of blind recesses.

A method comprising:

• forming a tape for attaching solder balls to a semiconductor device to form a ball grid array on the semiconductor device, forming the tape comprising:
• providing a heat-resistant first layer having a first side and a second side;
• forming a plurality of perforations through the first layer;
• applying a first adhesive coating to the first side of the first layer to form a first adhesive surface the first adhesive surface adapted to secure the heat-resistant first layer to the semiconductor device;
• providing a heat-resistant second layer having a third side;
• laminating the third side of the second layer to the second side of the first layer using a second adhesive, wherein the perforations in the first layer and the third side of the second layer form blind recesses configured to hold the solder balls, each blind recess configured to hold at most one solder ball, the third side in each blind recess forming a second adhesive surface therein;
• and
• forming a removable liner on the first adhesive surface, the removable liner having a plurality of perforations aligned with the plurality of blind recesses.

A method comprising:

• forming a tape for attaching solder balls to semiconductor devices to form ball grid arrays on the semiconductor devices, forming the tape comprising:
• providing a heat-resistant sheet;
• forming a plurality of tape segments on the sheet, each tape segment having a first side;
• forming a plurality of blind recesses on the first side of each tape segment, each blind recess configured to hold at most one of the solder balls;
• applying a first adhesive coating to the first side of each tape segment to form a first adhesive surface on each tape segment, the first adhesive surface adapted to secure the first adhesive surface to one of the semiconductor devices;
• applying a second adhesive coating to each blind recess to form in each tape segment a second adhesive surface therein;
• and
• forming a removable liner on the first adhesive surface of each tape segment, the removable liner having a plurality of perforations aligned with the plurality of blind recesses.

A method comprising:

• forming a tape for attaching solder balls to semiconductor devices to from ball grid arrays on the semiconductor devices, forming the tape comprising:
• providing a heat-resistant first sheet layer having a first side and a second side;
• forming a plurality of perforations through the first sheet layer;
• applying a first adhesive coating to the first side of the first sheet layer to form a first adhesive surface;
• providing a heat-resistant second sheet layer having a third side;
• laminating the third side of the second sheet layer to the second side of the first sheet layer, wherein the perforations in the first sheet layer and the third side of the second sheet layer form a plurality of blind recesses, each blind recess configured to hold at most one of the solder balls;
• applying a second adhesive to each blind recess forming a second adhesive surface therein;
• partitioning the first sheet layer to foam a plurality of tape segments, each tape segment having a portion of the first adhesive surface and a portion of the blind recesses such that the portion of the first adhesive surface is configured to secure the tape segment to one of the semiconductor devices;
• and
• forming a removable liner on the first adhesive surface, the removable liner having a plurality of perforations aligned with the plurality of blind recesses.