Method for manufacturing a trench capacitor having an isolation trench
AssigneeInfineon Technologies AG
InventorsGabriele Fichtl, Jana Haensel, Thomas Metzdorf, Thomas Morgenstern
Life of this patent
Estimating the term…
Loading patent…
AssigneeInfineon Technologies AG
InventorsGabriele Fichtl, Jana Haensel, Thomas Metzdorf, Thomas Morgenstern
Estimating the term…
A method for manufacturing a trench capacitor includes the step of etching a shallow isolation trench in a two-step process flow. During a first etching step, an etch chemistry based on chlorine or bromine performs a highly selective etch for silicon. During a second step, the etch chemistry is based on SiF4 and O2 which rather equally etches polysilicon and the collar isolation. On top of the wafer, the deposition of silicon oxide on the hard mask predominates and avoids an erosion of the hard mask. On the bottom of the trench the conformal etching of polysilicon and collar isolation predominates. The method provides an economic process flow and is suitable for small feature sizes.
A method for manufacturing a trench capacitor having an isolation trench, which comprises:
Dependencies are inferred from the claim text.