Semiconductor device and process for fabrication thereof

A process for fabricating a semiconductor device, comprising the steps of attaching a semiconductor chip to a support member with a die-bonding material, and encapsulating the semiconductor chip with a resin;

• said die-bonding material comprising a filmy die-bonding material comprising one or more resins selected from the group consisting of silicone resin, acrylic resin, polyimide resin and epoxy resin;
• the process further comprising the steps of:
• mounting said semiconductor chip on said filmy die-bonding material;
• and
• attaching said semiconductor chip to said filmy die-bonding material under conditions of a temperature of 150° C. to 250° C., bonding time of 0.1 (inclusive) second to 2 seconds, and a pressure of 0.1 to 4 gf/mm2.