Semiconductor devices having different package sizes made by using common parts
AssigneeNEC Electronics Corporation
InventorKosuke Azuma
Life of this patent
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Abstract
A semiconductor device having a semiconductor element and a plurality of segments formed by dividing a conductive plate. Some of the segments are electrically coupled with electrodes of said semiconductor element and constitute lead pad portions as mounting electrodes of the semiconductor device. Other segments among the plurality of divided segments constitute die pad portions on which the semiconductor element is mounted. The plurality of divided segments and the semiconductor element are sealed and supported together by a resin material portion. The resin material portion fills the space between the divided segments as the lead pad portions. Semiconductor devices having various package sizes can be fabricated by using standardized common parts.
Claims32
A method of manufacturing a semiconductor device comprising:
- preparing a conductive plate;
- forming concave-trenches in said conductive plate to form a plurality of segments;
- preparing a semiconductor element;
- mounting a semiconductor element on said conductive plate having said concave trenches formed therein;
- disposing resin material on said conductive plate wherein a part of said resin material enters at least a part of said concave trenches;
- and
- removing the backside portion of said conductive plate so as to expose bottom portions of said concave trenches.
A method of manufacturing a semiconductor device comprising:
- preparing a conductive plate;
- preparing a supporting sheet;
- sticking said conductive plate on said supporting sheet;
- cutting said conductive plate stuck on said supporting sheet to form a plurality of segments supported by said supporting sheet;
- preparing a semiconductor element;
- mounting a semiconductor element on at least one of said plurality of segments;
- and
- disposing resin material on said plurality of segments, wherein a part of said resin material enters at least a part of spaces between said segments.
A method of manufacturing a semiconductor device comprising:
- preparing a semiconductor element having electrodes on which bumps are formed;
- preparing a conductive plate;
- forming a first set of concave trenches in a lattice-like arrangement on the face side of said conductive plate;
- forming a second set of concave trenches in a lattice-like arrangement on the backside of said conductive plate, said second set of concave trenches are shifted from said first set of concave trenches in the direction along the surface of said conductive plate;
- mounting said semiconductor element on the face surface of said conductive plate, wherein electrodes of said semiconductor element are electrically coupled with segments divided by said first set of concave trenches via bumps;
- filling a space between said semiconductor element and said conductive plate with resin material;
- and
- cutting said conductive plate at locations shifted in the directions along the surface of said conductive plate from said first and second sets of concave trenches.
Dependencies are inferred from the claim text.