Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof

A method for manufacturing a semiconductor chip package, the method comprising:

• preparing a semiconductor chip having a plurality of center bonding pads formed on a surface of the semiconductor chip in a central area of the surface and a plurality of edge bonding pads formed along edges of the surface of the semiconductor chip;
• preparing a substrate comprising:
• a first window;
• a second window;
• a plurality of connection pads around the first and second windows on a top surface of the substrate;
• a plurality of external terminal pads on the top surface;
• and
• a wiring pattern that connects the connection pads to the external terminal pads;
• attaching the semiconductor chip on a bottom surface of the substrate such that the first window exposes the center bonding pads and the second window exposes the edge bonding pads;
• connecting the first and second bonding pads of the semiconductor chip to corresponding connection pads of the substrate;
• encapsulating side surfaces of the semiconductor chip, a portion of the bottom surface of the substrate, the bonding wires, and the connection pads;
• and
• forming external terminals on the external terminal pads of the substrate.