Stress balanced semiconductor packages, method of fabrication and modified mold segment
AssigneeMicron Technology, Inc.
InventorBlaine J. Thurgood
Life of this patent
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Abstract
Stress balanced semiconductor device packages, a method of forming, and a method of modifying a mold segment for use in the method are disclosed. A semiconductor die is attached to one side of a substrate having discrete conductive elements such as a ball grid array (BGA) on the opposing side thereof. An envelope of encapsulant material is disposed over the semiconductor die on one side of the substrate while a stress balancing structure comprising at least one stem member and at least one transversely extending branch member formed of encapsulant material is disposed over the opposing side of the substrate in an arrangement which does not interfere with the discrete conductive elements. The envelope and the stress balancing structure may be simultaneously formed.
Claims16
A method of fabricating a semiconductor package comprising:
- mounting at least one semiconductor die on a first side of a substrate;
- providing a plurality of discrete conductive elements disposed on an opposing side of the substrate;
- encapsulating the at least one semiconductor die on the first side of the substrate;
- forming at least one stem member on the opposing side of the substrate;
- and
- forming at least one branch member extending substantially transversely to the at least one stem member on the opposing side of the substrate, wherein the at least one stem member and the at least one branch member are formed by molding.
A method of fabricating a semiconductor package comprising:
- mounting at least one semiconductor die on a first side of a substrate;
- providing a plurality of discrete conductive elements disposed on an opposing side of the substrate:
- and
- substantially concurrently encapsulating the at least one semiconductor die on the first side of the substrate and forming at least one stem member and at least one branch member extending substantially transversely to the at least one stem member on the opposing side of the substrate.
A method of fabricating a semiconductor package comprising:
- mounting at least one semiconductor die on a first side of a substrate;
- providing a plurality of discrete conductive elements disposed on an opposing side of the substrate;
- encapsulating the at least one semiconductor die on the first side of the substrate;
- forming at least one stem member on the opposing side of the substrate;
- forming at least one branch member extending substantially transversely to the at least one stem member on the opposing side of the substrate;
- and
- wherein encapsulating the at least one semiconductor die and forming the at least one stem member and the at least one branch member comprises encapsulating the at least one semiconductor die with the same material used to form the at least one stem member and the at least one branch member.
Dependencies are inferred from the claim text.