Integrated circuit package and manufacturing method therefor with unique interconnector
AssigneeST Assembly Test Services Ltd.
InventorsJian Jun Li, Il Kwon Shim, Guruprasad Badakere
Life of this patent
Estimating the term…
Abstract
An integrated circuit package, and manufacturing method therefor, is provided. A substrate is provided having solder openings therein and a conductive layer thereon. The conductive layer is processed to form a plurality of pads over the solder openings in the substrate. A mask is formed over the plurality of pads and openings formed in the mask over at least two pads of the plurality of pads. An integrated circuit die is bonded over the substrate using a conductive adhesive where the conductive adhesive is placed in the openings in conductive contact with at least two pads of the plurality of pads.
Claims10
A method for manufacturing an integrated circuit comprising:
- providing a substrate having solder openings provided therein and a conductive layer thereon;
- processing the conductive layer to form a plurality of pads over the solder openings in the substrate;
- depositing a mask over the plurality of pads;
- forming openings in the mask over at least two pads of the plurality of pads;
- bonding an integrated circuit die over the substrate using a conductive adhesive;
- and
- placing the conductive adhesive in the openings in conductive contact with the at least two pads of the plurality of pads.
A method for manufacturing an integrated circuit comprising:
- providing a substrate having solder openings provided therein and a metal layer thereon;
- processing the metal layer to form a plurality of pads over the solder openings in the substrate;
- depositing a soldermask over the plurality of pads;
- forming openings in the soldermask over at least two pads of the plurality of pads;
- bonding an integrated circuit die over the substrate using a conductive die attach adhesive;
- and
- placing the conductive die attach adhesive in the openings in the soldermask and in conductive contact with the at least two pads of the plurality of pads.
Dependencies are inferred from the claim text.