Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same

Abstract

A resin tie bar 1A is formed from a base material 10, 11 of a heat-resistant resin whose melting point is higher than the temperature during resin molding and an insulative adhesive layer 12 on the base material 10, 11 and formed from an insulative adhesive agent that may or may not be removable prior to resin molding depending upon its composition. The resin tie bar 1A is applied to the surface of the leads 22 of a lead frame, and resin molding is then performed, during which the resin tie bar 1A is pressed by a heated mold 3, which softens the insulative adhesive agent of the resin tie bar 1A and pushes it into the gaps 23 between the leads 22 of the lead frame. Thus the resin tie bar 1A can be easily formed into a shape that is favorable for the leads 22 of the lead frame.

Dependencies are inferred from the claim text.