Deposited film forming apparatus and deposited film forming method

A method of forming a deposited film comprising:

• (a) introducing a source gas comprising a film-forming reactive gas into a vacuum chamber;
• and
• (b) supplying power from a power source to a power applying electrode spaced above a grounded flat plate base member, said power applying electrode and said base member disposed in the vacuum chamber, to generate a plasma in a discharge space between the power applying electrode and a substrate disposed in opposition to the power supplying electrode in the vacuum chamber to decompose the source gas and form a deposited film on the substrate, said power applying electrode fixed to the base member by a plurality of electrically insulating fastening members at positions effective to suppress deformation of the power applying electrode and an electrically insulating spacer being placed between the power supplying electrode and the base member to electrically insulate the power applying electrode from the base member.