Plating method and apparatus using contactless electrode
OwnerRahul Jairathinventor
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Abstract
A plating method and apparatus using contactless electrode is described. In one embodiment an inductive element is placed proximally to a substrate and a moving electromagnetic field generates an emf in the substrate to plate the surface. In another embodiment, a conductive plate is used, so that the conductive plate and the wafer, separated by a dielectric material, operate as two plates of a capacitor when voltage is applied to the conductive plate. The resulting electrostatic field impresses a charge potential on the substrate to plate the surface of the substrate.
Claims41
An apparatus comprising:
- an inductive element to be positioned proximal to a substrate so that when current flows through said inductive element, an electromagnetic field induces an electromotive force to generate a surface current on the substrate and when in presence of an electrolyte, the surface of the substrate is plated;
- and
- a housing to contain said inductive element therein and isolate said inductive element from the electrolyte.
A plating apparatus comprising:
- an inductive element to be positioned proximal to a substrate so that when current flows through said inductive element, an electromagnetic field induces an electromotive force to generate a surface current on the substrate and when in presence of an electrolyte, the substrate or a layer formed on the substrate is plated with a conductive material;
- and
- a housing constructed from a dielectric material to contain said inductive element therein and isolate said inductive element from the electrolyte.
An apparatus comprising:
- a capacitive element to be positioned proximal to a substrate so that when voltage is applied to said capacitive element, an electrostatic field extends to a surface of the substrate to generate a potential on the surface of the substrate and when in presence of an electrolyte, the surface of the substrate is plated;
- and
- a housing constructed from a dielectric material to contain said capacitive element therein and isolate said capacitive element from the electrolyte.
A plating apparatus comprising:
- a capacitive element to be positioned proximal to a substrate so that when voltage is applied to said capacitive element, an electrostatic field extends to a surface of the substrate to generate a potential on the surface of the substrate and when in presence of an electrolyte, the substrate or a layer formed on the substrate is plated with a conductive material;
- and
- a housing constructed from a dielectric material to contain said capacitive element therein and isolate said capacitive element from the electrolyte.
A method of plating comprising:
- placing a substrate surface to be plated proximal to a contactless electrode assembly in which an electrode element is disposed within a dielectric housing to isolate the electrode element from a plating electrolyte;
- introducing the plating electrolyte containing a plating chemistry to plate a surface of the substrate;
- applying power to the electrode to emanate an electromagnetic or electrostatic field which extends at least to the surface of the substrate;
- and
- inducing voltage at the surface to plate a conductive material onto the surface.
Dependencies are inferred from the claim text.