Method for manufacturing laminated multilayer electronic components

Abstract

A method for producing a laminated electronic component produces a laminated electronic component having a superior surge-proofing property, a sufficient resistance to a flux, and excellent electrical properties, without experience the occurrence of structural effects such as cracking, delamination, or other structural defects. Conductive paste is prepared to contain conductive particles and resin particles having a thermal decomposition-ability. The resin particles have an average particle size of about 0.25 to about 1.50 times the average particle size of the conductive particles. The volume ratio of the resin particles is in the range of about 0.5 to about 1.0 the volume of the conductive particles. The conductive paste is applied to the surface of a ceramic layer to form a conductor layer. The ceramic layers and the conductor layers are alternately laminated. The laminate is fired to form a ceramic sintered laminate. Thus, a laminated electronic component is produced.

Dependencies are inferred from the claim text.