Apparatus and method for producing substrate with electrical wire thereon

A method for producing a substrate having a substrate surface by polishing the substrate surface, which includes a metallic wire, comprising the steps of:

• supplying a polishing liquid to a clearance between the substrate surface and a polishing pad surface of a polishing pad, which polishing liquid includes an acid for dissolving an oxidized part of the substrate surface and is prevented substantially from including solid abrasive powder, and
• generating a relative movement between the substrate surface and the polishing pad surface while pressing the substrate surface against the polishing pad surface with the polishing liquid between the substrate surface and the polishing pad surface so that the dissolved oxidized part of the substrate surface is removed from the substrate,
• wherein a surfactant is added and supplied into the polishing liquid on the polishing pad surface so that a volume of the surfactant on the polishing pad surface is increased
• wherein the relative movement between the substrate surface and the polishing pad surface is being generated, when the surfactant is added and supplied into the polishing liquid on the polishing pad surface.

A method for producing a substrate having a substrate surface by polishing the substrate surface, which includes a metallic wire, comprising the steps of:

• supplying a polishing liquid to a clearance between the substrate surface and a polishing pad surface of a polishing pad, which polishing liquid includes an acid for dissolving an oxidized part of the substrate surface and is prevented substantially from including solid abrasive powder, and
• generating a relative movement between the substrate surface and the polishing pad surface while pressing the substrate surface against the polishing pad surface with the polishing liquid between the substrate surface and the polishing pad surface so that the dissolved oxidized part of the substrate surface is removed from the substrate,
• wherein a surfactant is added and supplied into the polishing liquid on the polishing pad surface so that a volume of the surfactant on the polishing pad surface is increased
• wherein the substrate surface is prevented from contacting the polishing pad surface, when the surfactant is added and supplied into the polishing liquid on the polishing pad surface.

An apparatus for producing a substrate having a substrate surface by polishing the substrate surface, which includes a metallic wire, comprising, a polishing pad holder for holding a polishing pad including a polishing pad surface for polishing the substrate surface, the polishing pad holder being movable relative to the substrate surface to generate a relative movement between the substrate surface and the polishing pad surface,

• a polishing liquid supplier for supplying a polishing liquid to a clearance between the substrate surface and the polishing pad surface, which polishing liquid includes an acid for dissolving an oxidized part of the substrate surface and is prevented substantially from including solid abrasive powder, and
• a pressure generator for pressing the substrate surface against the polishing pad surface with the polishing liquid between the substrate surface and the polishing pad surface during the relative movement,
• wherein the polishing liquid supplier is adapted to add and supply a surfactant into the polishing liquid on the polishing pad surface so that a volume of the surfactant on the polishing pad surface is increased, and
• wherein the relative movement between the substrate surface and the polishing pad surface is being generated, when the surfactant is added and supplied by the polishing liquid supplier into the polishing liquid on the polishing pad surface.

An apparatus for producing a substrate having a substrate surface by polishing the substrate surface, which includes a metallic wire, comprising, a polishing pad holder for holding a polishing pad including a polishing pad surface for polishing the substrate surface, the polishing pad holder being movable relative to the substrate surface to generate a relative movement between the substrate surface and the polishing pad surface,

• a polishing liquid supplier for supplying a polishing liquid to a clearance between the substrate surface and the polishing pad surface, which polishing liquid includes an acid for dissolving an oxidized part of the substrate surface and is prevented substantially from including solid abrasive powder, and
• a pressure generator for pressing the substrate surface against the polishing pad surface with the polishing liquid between the substrate surface and the polishing pad surface during the relative movement,
• wherein the polishing liquid supplier is adapted to add and supply a surfactant into the polishing liquid on the polishing pad surface so that a volume of the surfactant on the polishing pad surface is increased, and
• wherein the substrate surface is prevented from contacting the polishing pad surface, when the surfactant is added and supplied by the polishing liquid supplier into the polishing liquid on the polishing pad surface.