Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer
AssigneeJsr Corporation
InventorKou Hasegawa
Life of this patent
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Abstract
An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoint detection without lowering the polishing performance as well as methods for polishing of a semiconductor wafer using them. The polishing pad of the invention comprises a water-insoluble matrix material such as crosslinked 1,2-polybutadiene, and a water-soluble particle such as β-cyclodextrin dispersed in this water-insoluble matrix material, and has a light transmitting properties so that a polishing endpoint can be detected with a light.
Claims57
A polishing pad for a semiconductor wafer, which comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material, and having light transmitting properties.
- wherein at least a part of the water-insoluble matrix material is a crosslinked polymer.
A polishing pad for a semiconductor wafer, which comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material, and having light transmitting properties,
- wherein the light transmittance of the polishing pad at a wavelength between 400 and 800 mn is 0.1% or more, or an integrated transmittance in a wavelength range between 400 and 800 nm is 0.1% or more, at a polishing pad thickness of 2 mm, and
- wherein at least a part of the water-insoluble matrix material is a crosslinked polymer.
A polishing pad for a semiconductor, which comprises a substrate for a polishing pad having a through hole penetrating from the surface to the back, and a light transmitting part fitted in said through hole, wherein said light transmitting part comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material.
A laminated body for polishing of a semiconductor wafer, which comprises a polishing pad comprising a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material, and has light transmitting properties and a supporting layer laminated on a backside of said polishing pad,
- wherein said laminate has light transmitting properties in a laminated direction, and
- wherein at least a part of said water-insoluble matrix is a crosslinked polymer.
A laminated body for polishing of a semiconductor wafer, which comprises a polishing pad comprising a substrate for a polishing pad provided with a through hole penetrating from surface to back, and a light transmitting part fitted in said through hole,
- wherein said light transmitting part comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material, and a supporting layer laminated on a backside of said polishing pad,
- wherein said laminate has light transmitting properties in a laminated direction, and
- wherein at least a part of said water-insoluble matrix is a cross-linked polymer.
A method for polishing of a semiconductor wafer comprising
- polishing a semiconductor wafer with a laminated body and
- detecting a polishing endpoint with an optical endpoint detector,
- wherein the laminated body comprises a polishing pad comprising a water-insoluble matrix material and a water-soluble particle dispersed in the water-insoluble matrix material, and a supporting layer laminated on a backside of said polishing pad,
- wherein said laminate has light transmitting properties in a laminated direction, and
- wherein at least a part of said water-insoluble matrix is a cross-linked polymer.
A method for polishing of a semiconductor wafer comprising
- polishing a semiconductor wafer with a laminated body for polishing, and
- detecting a polishing endpoint using an optical endpoint detector,
- wherein the laminated body comprises a polishing pad comprising a substrate for a polishing pad provided with a through hole penetrating from surface to back, and a light transmitting part fitted in the through hole, and a supporting layer laminated on a backside of said polishing pad,
- wherein the light transmitting part comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material,
- wherein the laminate has light transmitting properties in a laminated direction, and
- wherein at least a part of said water-insoluble matrix is a cross-linked polymer.
A polishing pad for a semiconductor wafer, which comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material, and having light transmitting properties,
- wherein a light transmittance at a wavelength between 400 and 800 nm is 0.1% or more, or an integrated transmittance in a wavelength range between 400 and 800 nm is 0.1% or more, at a polishing pad thickness of 2 mm,
- wherein at least a part of the water-insoluble matrix material is a crosslinked polymer,
- wherein said crosslinked polymer is at least one of a crosslinked polyurethane resin, a crosslinked epoxy resin, a crosslinked polyacrylic resin, a crosslinked unsaturated polyester resin, a crosslinked vinyl ester resin except for a polyacrylic resin, a crosslinked 1,2-polybutadiene, a crosslinked butadiene rubber, a crosslinked isoprene rubber, a crosslinked acrylic rubber, a crosslinked acrylonitrile-butadiene rubber, a crosslinked styrene-butadiene rubber, a crosslinked ethylene-propylene rubber, a crosslinked silicone rubber, a crosslinked fluorine rubber, a crosslinked styrene-isoprene rubber, a crosslinked polyethylene, or a crosslinked poly(fluorinated vinylidene), and
- wherein said water-soluble particle is at least one of an organic water-soluble particle selected from the group consisting of dextrin, cyclodextrin, mannitol, lactose, hydroxypropylcellulose, methylcellulose, starch and protein, or an inorganic water-soluble particle.
A polishing pad for a semiconductor, which comprises a substrate for a polishing pad having a through hole penetrating from the surface to the back, and a light transmitting part fitted in said through hole, wherein said light transmitting part comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material,
- wherein a light transmittance of said light transmitting part at a wavelength between 400 and 800 nm is 0.1% or more, or an integrated transmittance of said light transmitting part in a wavelength range between 400 and 800 nm is 0.1% or more, at a thickness of 2 mm,
- wherein at least a part of the water-insoluble matrix material is a crosslinked polymer,
- wherein said crosslinked polymer is at least one of a crosslinked polyurethane resin, a crosslinked epoxy resin, a crosslinked polyacrylic resin, a crosslinked unsaturated polyester resin, a crosslinked vinyl ester resin except for a polyacrylic resin, a crosslinked 1,2-polybutadiene, a crosslinked butadiene rubber, a crosslinked isoprene rubber, a crosslinked acrylic rubber, a crosslinked acrylonitrile-butadiene rubber, a crosslinked styrene-butadiene rubber, a crosslinked ethylene-propylene rubber, a crosslinked silicone rubber, a crosslinked fluorine rubber, a crosslinked styrene-isoprene rubber, a crosslinked polyethylene, or a crosslinked poly(fluorinated vinylidene), and
- wherein said water-soluble particle is at least one of an organic water-soluble particle selected from the group consisting of dextrin, cyclodextrin, mannitol, lactose, hydroxypropylcellulose, methylcellulose, starch and protein, or an inorganic water-soluble particle.
A method for polishing of a semiconductor wafer comprising,
- polishing a semiconductor wafer with a polishing pad comprising a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material, and having light transmitting properties, and
- detecting a polishing endpoint with an optical endpoint detector,
- wherein a light transmittance of said light transmitting part at a wavelength between 400 and 800 nm is 0.1% or more, or an integrated transmittance of said light transmitting part in a wavelength range between 400 and 800 nm is 0.1% or more, at a thickness of 2 mm,
- wherein at least a part of the water-insoluble matrix material is a crosslinked polymer,
- wherein said crosslinked polymer is at least one of a crosslinked polyurethane resin, a crosslinked epoxy resin, a crosslinked polyacrylic-based resin, a crosslinked unsaturated polyester resin, a crosslinked vinyl ester resin except for a polyacrylic resin, a crosslinked 1,2-polybutadiene, a crosslinked butadiene rubber, a crosslinked isoprene rubber, a crosslinked acrylic rubber, a crosslinked acrylonitrile-butadiene rubber, a crosslinked styrene-butadiene rubber, a crosslinked ethylene-propylene rubber, a crosslinked silicone rubber, a crosslinked fluorine rubber, a crosslinked styrene-isoprene rubber, a crosslinked polyethylene, or a crosslinked poly(fluorinated vinylidene), and
- wherein said water-soluble particle is at least one of an organic water-soluble particle selected from the group consisting of dextrin, cyclodextrin, mannitol, lactose, hydroxypropylcellulose, methylcellulose, starch and protein, or an inorganic water-soluble particle.
A method for polishing of a semiconductor wafer comprising:
- polishing a semiconductor wafer with a polishing pad comprising a substrate for a polishing pad having a through hole penetrating from surface to back, and a light transmitting part fitted in said through hole, wherein said light transmitting part comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material, and
- detecting a polishing endpoint using an optical endpoint detector,
- wherein a light transmittance of said light transmitting part at a wavelength between 400 and 800 nm is 0.1% or more, or an integrated transmittance of said light transmitting part in a wavelength range between 400 and 800 nm is 0.1% or more, when a thickness is 2 mm,
- wherein at least a part of the water-insoluble matrix material is a crosslinked polymer,
- wherein said crosslinked polymer is at least one of a crosslinked polyurethane resin, a crosslinked epoxy resin, a crosslinked polyacrylic-based resin, a crosslinked unsaturated polyester resin, a crosslinked vinyl ester resin except for a polyacrylic resin, a crosslinked 1,2-polybutadiene, a crosslinked butadiene rubber, a crosslinked isoprene rubber, a crosslinked acrylic rubber, a crosslinked acrylonitrile-butadiene rubber, a crosslinked styrene-butadiene rubber, a crosslinked ethylene-propylene rubber, a crosslinked silicone rubber, a crosslinked fluorine rubber, a crosslinked styrene-isoprene rubber, a crosslinked polyethylene, or a crosslinked poly(fluorinated vinylidene), and
- wherein said water-soluble particle is at least one of an organic water-soluble particle selected from the group consisting of dextrin, cyclodextrin, mannitol, lactose, hydroxypropylcellulose, methylcellulose, starch and protein, or an inorganic water-soluble particle.
Dependencies are inferred from the claim text.