Modular method for chemical mechanical planarization
AssigneeStrasbaugh
InventorDavid G. Halley
Life of this patent
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Abstract
Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP module and at least one cleaning module to process one or more substrates therein. The plurality of modules are controllable separately by individual controllers associated separately with the modules. One of the modules is disengaged from the docking station, and is mechanically removed to free the module from the docking station, while the other modules are still operable to process the one or more substrates therein.
Claims21
A method of operating a modular chemical mechanical planarization process, the method comprising:
- operating a CMP apparatus comprising a docking station including a plurality of modules having at least one CMP module and at least one cleaning module to process one or more substrates therein, the plurality of modules being controllable separately by individual controllers associated separately with the modules;
- disengaging one of the modules from the docking station;
- mechanically removing the one disengaged module to free the module from the docking station;
- inserting a replacement module into the docking station and engaging the module for operation with the docking station while the other modules are still operable to process the one or more substrates therein;
- and
- prequalifying the replacement module using the individual controller associated with the replacement module to process one or more substrates therein for a preset process prior to inserting the replacement module into the docking station and engaging the module for operation with the docking station;
- wherein prequalifying the replacement module comprises processing one or more substrates therein for the preset process offline;
- and verifying that the replacement module meets preset minimum performance requirements based on process results of the one or more substrates processed therein.
A method of operating a modular chemical mechanical planarization process, the method comprising:
- operating a CMP apparatus comprising a docking station including a plurality of modules having at least one CMP module and at least one cleaning module to process one or more substrates therein;
- disengaging one of the modules from the docking station;
- inserting a replacement module into the docking station and engaging the module for operation with the docking station while the other modules are still operable to process the one or more substrates therein;
- and
- prequalifying the replacement module using the individual controller associated with the replacement module to process one or more substrates therein for a preset process prior to inserting the replacement module into the docking station and engaging the module for operation with the docking station;
- wherein prequalifying the replacement module comprises processing one or more substrates therein for the preset process offline;
- and verifying that the replacement module meets preset minimum performance requirements based on process results of the one or more substrates processed therein.
A method of operating a modular chemical mechanical planarization process, the method comprising:
- providing a plurality of modules having at least one CMP module and at least one cleaning module to process one or more substrates therein;
- prequalifying at least one of the plurality of modules separately each for a preset process associated therewith using the individual controller associated with the at least one module;
- coupling the plurality of modules including the at least one prequalified module with a docking station of a CMP apparatus;
- and
- operating the CMP apparatus to process one or more substrates in the plurality of modules;
- wherein prequalifying the at least one module comprises processing one or more substrates therein for the preset process associated therewith offline;
- and verifying that the at least one module meets preset minimum performance requirements based on process results of the one or more substrates processed therein.
Dependencies are inferred from the claim text.