IC socket assembly with improved heat sink

An integrated circuit (IC) socket assembly, comprising:

• an IC socket mounted on a circuit substrate and receiving an electronic package therein;
• a supporting member assembled on the circuit substrate and near the IC socket, the supporting member defining a window in a middle thereof;
• a heat sink assembled on the supporting member in the window, the heat sink comprising a jacket attached on the electronic package, the jacket defining a channel for containing cooling liquid;
• and
• an actuation member assembled on the supporting member, the actuation member being able to be operated to press the jacket against the electronic package;
• a supporting plate assembled on the circuit substrate to reinforce the circuit substrate;
• wherein the supporting plate comprises a base portion and four extending portions extending from four corners of the base portion respectively, the base portion defining a rectangular opening in a middle portion thereof and each extending portion defining a screw hole in an end thereof.