Very high bandwidth electrical interconnect
AssigneeParicon Technologies Corporation
InventorRoger E. Weiss
Life of this patent
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Abstract
A very high bandwidth electrical interconnect for conducting signals at high frequency. The interconnect includes a number of separate fine wire structures. Each such fine wire structure is made up of a string of generally spherical elements, each such element having a ferromagnetic core and a conductive coating over the core. The interconnect also includes an insulating medium surrounding the wire structures.
Claims17
A very high bandwidth electrical interconnect for conducting signals at high frequency comprising:
- a plurality of fine wire structures, each comprising a string of generally spherical elements, wherein the elements comprise a magnetic or ferromagnetic core and a conductive coating over the core;
- and
- an insulating medium surrounding the wire structures.
A method of constructing an electrical interconnect for high frequency conduction, comprising:
- providing a plurality of generally spherical particles that are conductive and ferromagnetic, the particles having a ferromagnetic core and a conductive layer over the core;
- mixing the particles with an uncured insulating resin;
- exposing the mixture to a magnetic field that defines a plurality of generally parallel and spaced magnetic field lines, to align the particles along the field lines into a series of aligned, touching conductive particles that make tangential contact with one another, to form a plurality of fine wire structures;
- and
- while the mixture is exposed to the magnetic field, at least partially curing the resin, to hold the wire structures in place and electrically insulate them from one another.
A very high bandwidth electrical interconnect for conducting signals at high frequency comprising:
- a plurality of fine wire structures, each comprising a string of generally spherical elements, wherein the elements comprise a magnetic or ferromagnetic core and a conductive coating over the core and wherein the elements contact each other over an area ranging from about 1% to about 70% of the particle diameter;
- and
- an insulating medium surrounding the wire structures.
A very high bandwidth electrical interconnect far conducting signals at high frequency comprising:
- a plurality of fine wire structures, each comprising a string of generally spherical separate particles, wherein the particles comprise a nickel core and a conductive coating over the core, wherein the coating comprises a material softer than nickel;
- and
- an insulating medium surrounding the wire structures.
Dependencies are inferred from the claim text.