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US 6,854,980 B2Granted
Probe card
AssigneeAgilent Technologies, Inc.
InventorYukoh Iwasaki
Life of this patent
Estimating the term…
Abstract
The present invention provides a probe card comprising a substrate and an external connection terminal located on substrate, wherein external connection terminal 1 is separated from a body of substrate by conductors attached to the substrate, whereby the waiting time due to dielectric absorption can be constantly shortened, and the steady-state leakage current can be stably reduced, thereby enhancing the accuracy of measuring microcurrents and determining microcurrent fluctuations for semiconductor wafer testing devices.
Claims6
A probe card comprising:
- a substrate comprising a first layer and a second layer;
- a support dielectric material disposed in said substrate, said support dielectric material having a side and a bottom, wherein said first layer opposes said side of said support dielectric material;
- an external connection terminal placed on said support dielectric material;
- and
- a conductor layer disposed between and in substantial contact with said support dielectric material and said first layer at all of said side of said support dielectric material and between and in substantial contact with said support dielectric material and said second layer at said bottom of said support dielectric material, wherein all of said sides of said support dielectric material are completely covered with said conductor layers.
2 more elements
A probe card comprising:
- a substrate comprising a first layer and a second layer;
- a support dielectric material disposed in said substrate, said support dielectric material having a side and a bottom, wherein said first layer opposes said side of said support dielectric material;
- an external connection terminal placed on said support dielectric material;
- and
- a conductor layer disposed between and in substantial contact with said substrate and dielectric support material on all of said side and bottom of said dielectric support material, there being substantially no space between said conductor layer and said first layer at said side of said support dielectric material, wherein all of said sides of said support dielectric material are completely covered with said conductor layers.
2 more elements
Dependencies are inferred from the claim text.